公开(公告)号：US20010004548A1

公开(公告)日：2001-06-21

申请号：US09734077

申请日：2000-12-11

Applicant: U.S. PHILIPS CORPORATION

Inventor： Ian D. French

IPC: H01L021/3205

CPC classification number: H01L27/14609 ,  H01H1/0036 ,  H01H59/0009 ,  H01H67/22 ,  H01L27/14643 ,  H01L27/14689 ,  H01L27/14692

Abstract: A method of manufacturing an electronic device comprising an integrated circuit device having micromechanical switches (10) and thin film circuit components (20) provided on a common substrate (2). The micromechanical switches (10) have contact beams (12) extending over a respective sacrificial region. Component layers (5) for forming the thin film circuit components are used as the sacrificial region in the area of the substrate allocated to the micromechanical switches . This enables various layers to be shared between the switches and the components. A supplementary support layer (50) may be provided for the contact beams to protect them against damage during subsequent processing and fabrication stages. A portion of this support layer can be left attached to the beam in the completed device for increased strength.

Abstract translation: 一种制造电子装置的方法，包括具有微机械开关（10）和设置在公共基板（2）上的薄膜电路部件（20））的集成电路装置。 微机械开关（10）具有在相应的牺牲区域上延伸的接触梁（12）。 用于形成薄膜电路部件的部件层（5）用作分配给微机械开关的基板的区域中的牺牲区域。 这使得可以在开关和组件之间共享各层。 可以为接触梁提供补充支撑层（50），以在后续处理和制造阶段保护它们免受损坏。 该支撑层的一部分可以在完成的装置中附着到梁上以增加强度。