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公开(公告)号：US20190066724A1
公开(公告)日：2019-02-28
申请号：US16171005
申请日：2018-10-25
Applicant: UACJ CORPORATION , FURUKAWA ELECTRIC CO., LTD.
Inventor： Toshihiro NAKAMURA , Takashi NAKAYAMA , Kimie IMAKAWA , Wataru KUMAGAI , Sadayuki TODA , Kotaro KITAWAKI , Takuya MURATA , Yu MATSUI , Makoto YONEMITSU , Hideyuki HATAKEYAMA
Abstract: An aluminum alloy substrate for a magnetic disk, wherein the sum of the circumferences of second phase particles having the longest diameter of 4 μm or more and 30 μm or less in the metal microstructure is 10 mm/mm2 or more.
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公开(公告)号：US20240005958A1
公开(公告)日：2024-01-04
申请号：US18252076
申请日：2021-11-11
Applicant: UACJ CORPORATION , FURUKAWA ELECTRIC CO., LTD.
Inventor： Naoki KITAMURA , Kotaro KITAWAKI , Hideyuki HATAKEYAMA , Ryohei YAMADA , Toshihiro NAKAMURA
IPC: G11B17/038 , G11B5/02
CPC classification number: G11B17/038 , G11B5/02 , G11B2005/0021
Abstract: A hard disk drive is a 3.5-inch hard disk drive on which a magnetic disk formed of an aluminum alloy substrate is mounted. A thickness Td of each of magnetic disks that are arranged in a stacked manner is 0.3 mm or more and 0.6 mm or less, the number N of the magnetic disks is 10 or more and 16 or less, and an outer diameter 2Rso of a spacer that is arranged between the magnetic disks is 35 mm or more and 65 mm or less. The outer diameter 2Rso (mm) of the spacer satisfies 2Rso≥−60Td+70 and 2Rso≤−0.5N2+16.5N−73.
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公开(公告)号：US20210082465A1
公开(公告)日：2021-03-18
申请号：US17028885
申请日：2020-09-22
Applicant: FURUKAWA ELECTRIC CO., LTD. , UACJ CORPORATION
Inventor： Kimie IMAKAWA , Toshihiro NAKAMURA , Hideki TAKAHASHI , Keita YOSHIMURA , Wataru KUMAGAI , Naoki KITAMURA , Kotaro KITAWAKI
Abstract: An aluminum alloy substrate (1) for magnetic disk satisfies at least two of three inequalities of an inequality group [A] and satisfies all of four inequalities of an inequality group [B], or satisfies at least two of the three inequalities of the inequality group [A] and satisfies all of four inequalities of an inequality group [C], when a plate thickness of the disk at a position (b1) is defined as tb1, a plate thickness at a position (b2) is defined as tb2, a plate thickness at a position (b3) is defined as tb3, a plate thickness at a position (a1) is defined as ta1, a plate thickness at a position (a2) is defined as ta2, and a plate thickness at a position (a3) is defined as ta3.
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Patent Agency Ranking
4.发明申请公开(公告)号：US20210008864A1
公开(公告)日：2021-01-14
申请号：US17035467
申请日：2020-09-28
Applicant: FURUKAWA ELECTRIC CO., LTD. , UACJ CORPORATION
Inventor： Toshihiro NAKAMURA , Hideki TAKAHASHI , Kimie IMAKAWA , Naoki KITAMURA , Kotaro KITAWAKI , Takuya MURATA
Abstract: A peeling apparatus for an aluminum plate material is configured to be able to peel one or a plurality of aluminum plate materials from a stack of aluminum plate materials in which a plurality of aluminum plate materials are pressure-annealed and adhered to each other. The peeling apparatus includes a vibration transmitting section that is configured to be able to abut an outer peripheral surface of an aluminum plate material and is configured to be able to apply vibration along a stacking direction of the stack to the aluminum plate material, and a transducer that generates the vibration, and transmits the vibration to the vibration transmitting section.
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公开(公告)号：US20140349076A1
公开(公告)日：2014-11-27
申请号：US14453255
申请日：2014-08-06
Applicant: Furukawa Electric Co., Ltd.
Inventor： Toshihiro NAKAMURA
IPC: C03B23/037 , C03C15/00
CPC classification number: C03B23/037 , C03C15/00 , C03C15/02 , Y10T428/24479
Abstract: There is provided a method of manufacturing a plate member including preparing a base plate member having main faces, and performing etching by immersing at least part of the base plate member in an etching liquid while controlling a lowering speed of a liquid surface of the etching liquid on the main faces of the base plate member to a desired lowering speed.
Abstract translation: 提供一种制造板构件的方法，该板构件包括准备具有主面的基板构件，并且通过将基板构件的至少一部分浸入蚀刻液中进行蚀刻，同时控制蚀刻液的液面的降低速度 在基板构件的主面上以期望的下降速度。
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公开(公告)号：US20200227877A1
公开(公告)日：2020-07-16
申请号：US16739205
申请日：2020-01-10
Inventor： Toshihiro NAKAMURA , Takashi NAKAYAMA , Tomohiro NAKAYAMA
Abstract: A conductor connection device for joining a plurality of conductors with ultrasonic welding, the conductor connection device comprising: a horn including a contact surface that is brought into contact with the conductors, the horn being configured to be ultrasonically vibrated; a pair of restricting portions configured to be brought into contact with the contact surface and to be relatively movable along the contact surface; and an anvil that is relatively moved toward and away from the contact surface, the horn and the pair of restricting portions being moved relative to the anvil to sandwich the anvil between the pair of restricting portions facing each other, and at least one of the pair of restricting portions being moved toward the other.
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公开(公告)号：US20240014640A1
公开(公告)日：2024-01-11
申请号：US18471772
申请日：2023-09-21
Inventor： Toshihiro NAKAMURA , Kazuhiro HIGUCHI , Yukihiro TORIMOTO , Tomohiro NAKAYAMA , Hiroshi TAKANO , Ryo NAKAGAWA
IPC: H02G1/14
CPC classification number: H02G1/14
Abstract: (Problem) To provide an electric cable connection method for joining terminal conductors in an assembled state and a joined electric cable. (Solution to the Problem) An electric cable connection method is a method for connecting exposed terminal conductors 21a of a plurality of covered electric cables 20 so as to be conductive. The electric cable connection method includes an assembly step s2 of assembling the covered electric cables 20; a fixing step s3 of fixing the terminal conductors 21a of the assembly of the plurality of electric cables 20 with a resin cover 50; and a joining step s4 of setting the plurality of covered electric cables having the plurality of terminal conductors 21a fixed with the resin cover 50 in an electric cable connection device 40, and joining the plurality of exposed terminal conductors 21a.
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公开(公告)号：US20210028562A1
公开(公告)日：2021-01-28
申请号：US17066672
申请日：2020-10-09
Inventor： Toshihiro NAKAMURA , Tomohiro NAKAYAMA
Abstract: [Object]
The present invention provides a joined conductor and a method for manufacturing a joined conductor that can improve electrical conductivity between conductors.
[Solution]
In a joined conductor 100 including a joining portion 110 in which a plurality of conductors exposed portions 220 arranged along a longitudinal direction X are fused and joined, the joining portion 110 is configured to have a substantially rectangular shape in an orthogonal cross section orthogonal to the longitudinal direction X, and among a pair of side surfaces in width direction 120 and a pair of side surfaces in up-down direction 130 configured such that a first surface 121 and a second surface 122 that face each other in the orthogonal cross section, and a horn 131 and a horn 132 are paired, on each of the first surface 121 and the second surface 122 of the pair of side surfaces in width direction 120 that are at least one pair, a corrugated portion 140 that has a corrugated shape and in which a ridge 141 protruding outward and a valley 142 recessed inward are alternately continuously provided along the longitudinal direction X is formed.
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