公开(公告)号：US20230420818A1

公开(公告)日：2023-12-28

申请号：US18121476

申请日：2023-03-14

Applicant: UNIMICRON TECHNOLOGY CORP ,  TUNGHAI UNIVERSITY

Inventor： Chi-Feng CHEN ,  Po-Sheng YEN ,  Ruey-Beei WU ,  Ra-Min TAIN ,  Chin-Sheng WANG ,  Jun-Ho CHEN

IPC: H01P1/203

CPC classification number: H01P1/20309

Abstract: A multi-layered resonator circuit structure and a multi-layered filter circuit structure. The multi-layered resonator circuit structure includes a multi-layered substrate, a plurality of resonators and a plurality of conductive components. The multi-layered substrate has a top surface, a bottom surface, and a ground layer. The top surface and the bottom surface face away from each other. The ground layer is located between the top surface and the bottom surface. A part of the plurality of resonators is/are disposed on the top surface. Another part of the plurality of resonators is/are disposed on the bottom surface. The plurality of conductive components is located in the multi-layered substrate. The plurality of resonators is electrically connected to the ground layer, respectively, via the plurality of conductive components.

公开(公告)号：US20220377874A1

公开(公告)日：2022-11-24

申请号：US17818004

申请日：2022-08-08

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng WANG ,  Pei-Chang HUANG

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/00

Abstract: A method of manufacturing a circuit board is provided. The method includes forming an open substrate, in which the open substrate includes a substrate body having a top surface and a bottom surface; an opening in the substrate body, in which the opening has a first sidewall and a second sidewall opposite to the first sidewall; and at least one first fixing portion and at least one second fixing portion extending from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. A heat dissipation block is inserted in the opening to clamp the heat dissipation block between the first fixing portion and the second fixing portion, in which the heat dissipation block includes the heat dissipation block comprises a ceramic or a composite material.

公开(公告)号：US20200214120A1

公开(公告)日：2020-07-02

申请号：US16283849

申请日：2019-02-25

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng WANG ,  Pei-Chang HUANG

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K3/00

Abstract: A method of manufacturing a circuit board having a heat dissipation block includes forming an opening through a substrate to form an open substrate. The opening has a first sidewall and a second sidewall opposite to each other, and the open substrate includes a substrate body surrounding the opening, at least one first fixing portion extending from the substrate body toward the opening and protruding from the first sidewall, and at least one second fixing portion extending from the substrate body toward the opening and protruding from the second sidewall. The heat dissipation block is then clamped between the first fixing portion and second fixing portion to fix the heat dissipation block in the opening.

公开(公告)号：US20240377598A1

公开(公告)日：2024-11-14

申请号：US18213142

申请日：2023-06-22

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chin-Sheng WANG ,  Kai-Ming YANG ,  Chen-Hao LIN ,  Pu-Ju LIN

IPC: G02B6/42

Abstract: A co-packaged structure for optics and electrics includes a substrate, an optical module and an electrical connection layer. The optical module includes a carrier and an optical transceiver unit. The carrier is mounted on the substrate. The optical module is mounted on the carrier. The electrical connection layer is mounted on the substrate, and the carrier is electrically connected with a circuitry on the substrate through the electrical connection layer. A plurality of fiber accommodation through hole are formed on the substrate and correspond to the optical transceiver unit.

公开(公告)号：US20210144841A1

公开(公告)日：2021-05-13

申请号：US17153856

申请日：2021-01-20

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng WANG ,  Pei-Chang HUANG

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/00

Abstract: A circuit board includes an open substrate and a heat dissipation block. The open substrate includes a substrate body, an opening and at least one first fixing portion and at least one second fixing portion. The substrate body has a top surface and a bottom surface. The opening is in the substrate body and has a first sidewall and a second sidewall opposite to the first sidewall. The first fixing portion and the second fixing portion extends from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. The heat dissipation block is directly clamped between the first fixing portion and the second fixing portion.

公开(公告)号：US20190096845A1

公开(公告)日：2019-03-28

申请号：US16203635

申请日：2018-11-29

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng WANG ,  Ra-Min TAIN

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/73 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13647 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/29147 ,  H01L2224/32227 ,  H01L2224/73104 ,  H01L2224/81204 ,  H01L2224/81447 ,  H01L2924/351 ,  H01L2924/00014

Abstract: A chip module includes a body, a bump, and a first bonding layer. The bump is disposed on the body. The first bonding layer is disposed on the bump. The first bonding layers and the bump are made of the same conductive material and the first bonding layer is porous.