公开(公告)号：US20250105536A1

公开(公告)日：2025-03-27

申请号：US18605597

申请日：2024-03-14

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Ra-Min TAIN ,  Chunhsien CHIEN ,  Ching-Ho HSIEH ,  Ming-Hsing WU

IPC: H01R12/71

Abstract: A connector and a manufacturing method thereof. The connector includes at least one circuit substrate, at least one contact and a first elastic body. The at least one circuit substrate has a first surface. The at least one contact includes a fixed part and a first contact part that are connected to each other. The fixed part is disposed on the at least one circuit substrate. The first contact part protrudes out of the first surface and covers a part of the first surface. The first elastic body is disposed on the first surface and is electrically insulated. At least a part of the first elastic body is located between the first contact part and the first surface.

公开(公告)号：US20210273356A1

公开(公告)日：2021-09-02

申请号：US17322906

申请日：2021-05-18

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang TSENG ,  Pei-Wei WANG ,  Ching-Ho HSIEH ,  Shao-Chien LEE ,  Kuo-Wei LI

IPC: H01R12/62 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

公开(公告)号：US20230291139A1

公开(公告)日：2023-09-14

申请号：US17661282

申请日：2022-04-28

Applicant: Unimicron Technology Corp.

Inventor： Ching-Ho HSIEH ,  Ming-Hsing WU ,  Keui-Sheng WU

IPC: H01R13/17 ,  H01R12/70

CPC classification number: H01R13/17 ,  H01R12/7076

Abstract: A connector includes a substrate, a coverlay and a spring contact. The substrate has a first surface, a second surface opposite to the first surface and a conductive through hole extending between the first and second surfaces. The coverlay is disposed on the first surface and includes a first opening. The spring contact includes an anchor member, a rising member and a pin. The anchor member is disposed between the substrate and the coverlay. The rising member extends from the anchor member and through the first opening in a direction away from the substrate. A first portion of the rising member is in the first opening, and a second portion of the rising member is out of the first opening. The pin extends from the anchor member to an inside of the conductive through hole, and is electrically connected to the conductive through hole.