公开(公告)号：US20220146207A1

公开(公告)日：2022-05-12

申请号：US17113332

申请日：2020-12-07

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Pu-Ju LIN ,  Ying-Chu CHEN ,  Wei-Ci YE ,  Chi-Hai KUO ,  Cheng-Ta KO

IPC: F28D15/04 ,  H05K7/20 ,  C23F17/00

Abstract: A vapor chamber device has a housing and multiple chambers. The housing includes two shells opposite to each other. The chambers are formed between the two shells. Each chamber contains a working fluid and has at least one diversion bump and a capillary structure. The diversion bump is formed on an inner surface of the second shell, and the capillary structure is mounted on the diversion bump. Since the chambers are independent from one another, when the vapor chamber device is vertically mounted to a heat source, the chambers at an upper portion of the vapor chamber device still contain the working fluid. The working fluid in the vapor chamber device may not all flow to a bottom of the vapor chamber device. Therefore, a contact area between the working fluid and the heat source is increased and heat dissipation efficiency is improved.