公开(公告)号：US20220146207A1

公开(公告)日：2022-05-12

申请号：US17113332

申请日：2020-12-07

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Pu-Ju LIN ,  Ying-Chu CHEN ,  Wei-Ci YE ,  Chi-Hai KUO ,  Cheng-Ta KO

IPC: F28D15/04 ,  H05K7/20 ,  C23F17/00

Abstract: A vapor chamber device has a housing and multiple chambers. The housing includes two shells opposite to each other. The chambers are formed between the two shells. Each chamber contains a working fluid and has at least one diversion bump and a capillary structure. The diversion bump is formed on an inner surface of the second shell, and the capillary structure is mounted on the diversion bump. Since the chambers are independent from one another, when the vapor chamber device is vertically mounted to a heat source, the chambers at an upper portion of the vapor chamber device still contain the working fluid. The working fluid in the vapor chamber device may not all flow to a bottom of the vapor chamber device. Therefore, a contact area between the working fluid and the heat source is increased and heat dissipation efficiency is improved.

公开(公告)号：US20230402391A1

公开(公告)日：2023-12-14

申请号：US17814527

申请日：2022-07-24

Applicant: Unimicron Technology Corp.

Inventor： Ying-Chu CHEN ,  Jeng-Ting LI ,  Chi-Hai KUO ,  Cheng-Ta KO ,  Pu-Ju LIN

IPC: H01L23/538 ,  H01L23/29 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/5385 ,  H01L23/5383 ,  H01L23/293 ,  H01L21/4857 ,  H01L21/56

Abstract: A manufacturing method of a package structure includes: forming a redistribution layer on a top surface of a glass substrate; forming a protective layer on the top surface of the glass substrate; cutting the glass substrate and the protective layer such that the glass substrate has a cutting edge, in which a crack is formed in the cutting edge of the glass substrate; and heating the protective layer such that a portion of the protective layer flows towards a bottom surface of the glass substrate to cover the cutting edge of the glass substrate and fill the crack in the cutting edge of the glass substrate.

公开(公告)号：US20230231087A1

公开(公告)日：2023-07-20

申请号：US17653659

申请日：2022-03-07

Applicant: Unimicron Technology Corp.

Inventor： Hao-Wei TSENG ,  Chi-Hai KUO ,  Jeng-Ting LI ,  Ying-Chu CHEN ,  Pu-Ju LIN ,  Cheng-Ta KO

IPC: H01L33/54 ,  H01L25/075 ,  H01L23/00

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L24/83 ,  H01L2933/005 ,  H01L24/29 ,  H01L2224/29194 ,  H01L2224/83099 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/8389 ,  H01L2224/83856 ,  H01L24/32 ,  H01L2224/32227 ,  H01L2924/12041

Abstract: A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.