公开(公告)号：US20230239997A1

公开(公告)日：2023-07-27

申请号：US17701964

申请日：2022-03-23

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Tzu Hsuan Wang ,  Yu Cheng Lin

IPC: H05K1/02

CPC classification number: H05K1/024 ,  H05K1/0242 ,  H05K1/0251 ,  H05K1/0298 ,  H05K2201/0195

Abstract: A method of a circuit signal enhancement of a circuit board comprises the following steps: forming a first substrate body with a first signal transmission circuit layer and a second substrate body with a second signal transmission circuit layer; forming a first signal enhancement circuit layer and a second signal enhancement circuit layer on the first substrate body and the second substrate body; forming a third substrate body with a third signal transmission circuit layer and a fourth substrate body with a fourth signal transmission circuit layer on the carrier; separating the third substrate body and the fourth substrate body from the carrier; combining the first signal transmission circuit layer and the third signal transmission circuit layer through the first signal enhancement circuit layer; and combining the second signal transmission circuit layer and the fourth signal transmission circuit layer through the second signal enhancement circuit layer.

公开(公告)号：US11937366B2

公开(公告)日：2024-03-19

申请号：US17701964

申请日：2022-03-23

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Tzu Hsuan Wang ,  Yu Cheng Lin

IPC: H05K1/02

CPC classification number: H05K1/024 ,  H05K1/0242 ,  H05K1/0251 ,  H05K1/0298 ,  H05K2201/0187 ,  H05K2201/0195

Abstract: A method of a circuit signal enhancement of a circuit board comprises the following steps: forming a first substrate body with a first signal transmission circuit layer and a second substrate body with a second signal transmission circuit layer; forming a first signal enhancement circuit layer and a second signal enhancement circuit layer on the first substrate body and the second substrate body; forming a third substrate body with a third signal transmission circuit layer and a fourth substrate body with a fourth signal transmission circuit layer on the carrier; separating the third substrate body and the fourth substrate body from the carrier; combining the first signal transmission circuit layer and the third signal transmission circuit layer through the first signal enhancement circuit layer; and combining the second signal transmission circuit layer and the fourth signal transmission circuit layer through the second signal enhancement circuit layer.