公开(公告)号：US11497115B2

公开(公告)日：2022-11-08

申请号：US16944178

申请日：2020-07-31

Applicant: UNIMICRON TECHNOLOGY CORPORATION

Inventor： Yi Lin ,  Hsiao-Han Huang ,  Yu-Hsin Pan

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/10

Abstract: Carrier board structure with an increased core-layer trace area and method for manufacturing the same are introduced. The carrier board structure comprises a core layer structure, a first circuit build-up structure, and a second circuit build-up structure. The core layer structure comprises a core layer, a signal transmission portion, and an embedded circuit layer, wherein the signal transmission portion and the embedded circuit layer are disposed inside the core layer and electrically connected. The first circuit build-up structure is disposed on the core layer on a same side as the embedded circuit layer and is electrically connected to the embedded circuit layer. The second circuit build-up structure is disposed on the core layer on a same side as the signal transmission portion, and is electrically connected to the first circuit build-up structure through the signal transmission portion and the embedded circuit layer.