公开(公告)号：US20160237573A1

公开(公告)日：2016-08-18

申请号：US15025427

申请日：2014-10-17

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： Aaron T. Nardi ,  Tahany Ibrahim El-Wardany ,  William Werkheiser ,  Michael A. Klecka

IPC: C23C24/04 ,  B32B15/01

CPC classification number: C23C24/04 ,  B24C1/10 ,  B32B15/01

Abstract: One embodiment includes a method for enhancing bond strength between a powder deposit and a substrate. Powder is deposited on the substrate. Powder is shot peened with peening media that is harder than both the powder and the substrate to produce bond strength between the powder and the substrate that is at least twice bond strength between the powder and the and peening material substrate without shot peening.

Abstract translation: 一个实施方案包括用于增强粉末沉积物和基底之间的结合强度的方法。 粉末沉积在基材上。 粉末用喷丸硬化粉末喷丸硬化，其比粉末和基材都硬，以在粉末和基材之间产生粘结强度，其在粉末和喷丸材料基材之间的粘合强度至少为两倍而没有喷丸硬化。

公开(公告)号：US20150352618A1

公开(公告)日：2015-12-10

申请号：US14732329

申请日：2015-06-05

Applicant: United Technologies Corporation

Inventor： Wayde R. Schmidt ,  William Werkheiser

IPC: B21D5/00

CPC classification number: B21D5/00 ,  B21D11/08 ,  B29C53/04 ,  B29C53/80 ,  B29C2793/0045 ,  B29C2793/0081 ,  B33Y10/00 ,  B33Y80/00 ,  Y10T29/49995 ,  Y10T428/24628

Abstract: A folded sheet assembly and method of manufacture includes a sheet having an un-folded state with a pre-determined bend-line. The sheet may be weakened along the bend-line to facilitate precise bending of the sheet and into a folded state. A segment of the assembly is additively manufactured to the bend for reinforcement. Weakening of the sheet along the bend-line may be achieved by placement of perforations through the sheet when in the unfolded state. The perforations may be filled by the segment when the sheet is in the folded state.

Abstract translation: 折叠片组件和制造方法包括具有预定弯曲线的未折叠状态的片材。 片材可以沿着弯曲线减弱，以便片材的精确弯曲并处于折叠状态。 组件的一部分被加工成弯曲以加强。 沿着弯曲线的薄片的减弱可以通过在处于展开状态时通过片材的穿孔放置来实现。 当片材处于折叠状态时，穿孔可以由片段填充。

公开(公告)号：US09938624B2

公开(公告)日：2018-04-10

申请号：US15025427

申请日：2014-10-17

Applicant: United Technologies Corporation

Inventor： Aaron T. Nardi ,  Tahany Ibrahim El-Wardany ,  William Werkheiser ,  Michael A. Klecka

IPC: C23C24/04 ,  B32B15/01 ,  B24C1/10

CPC classification number: C23C24/04 ,  B24C1/10 ,  B32B15/01

Abstract: One embodiment includes a method for enhancing bond strength between a powder deposit and a substrate. Powder is deposited on the substrate. Powder is shot peened with peening media that is harder than both the powder and the substrate to produce bond strength between the powder and the substrate that is at least twice bond strength between the powder and the substrate without shot peening.