公开(公告)号：US11874540B2

公开(公告)日：2024-01-16

申请号：US17587679

申请日：2022-01-28

Applicant: UNIVERSITY OF SOUTHAMPTON

Inventor： Weiwei Zhang ,  Graham Reed ,  David Thomson ,  Martin Ebert ,  Shinichi Saito

IPC: G02F1/025

CPC classification number: G02F1/025 ,  G02F2202/06

Abstract: A resonator modulator for modulating light in a photonic circuit, the modulator comprising: a capacitor formed of a ring-shaped insulating region sandwiched between an outer conductive region and an inner conductive region, wherein at least one of the outer conductive regions or the inner conductive regions is a polycrystalline semiconductor material.

公开(公告)号：US12189182B2

公开(公告)日：2025-01-07

申请号：US17779436

申请日：2020-11-27

Applicant: UNIVERSITY OF SOUTHAMPTON

Inventor： David Thomson ,  Graham Reed ,  Weiwei Zhang ,  Martin Ebert

IPC: G02B6/122 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136 ,  G02B6/12

Abstract: A method of manufacturing a photonic chip. The method comprises providing a wafer comprising a silicon substrate, and a low refractive index layer above the silicon substrate, forming a first trench having a first height and a second trench having a second height by etching the low refractive index layer. The second height is greater than the first height and the second trench has a bottom surface that is closer to the substrate than a bottom surface of the first trench.