公开(公告)号：US12100560B2

公开(公告)日：2024-09-24

申请号：US17742690

申请日：2022-05-12

申请人： UT-Battelle, LLC

发明人： Shajjad Chowdhury ,  Raj Sahu ,  Emre Gurpinar ,  Burak Ozpineci

IPC分类号： H01G4/38 ,  H01G4/232 ,  H05K1/16 ,  H01G4/12

CPC分类号： H01G4/38 ,  H01G4/232 ,  H05K1/162 ,  H01G4/1245 ,  H05K2201/09227

摘要： A capacitor packaging having a central termination and three or more capacitors (or groups of capacitors) arranged about the central termination. The electrical flow paths between the termination and the capacitors or groups of capacitors are of substantially the same length. The capacitors or groups of capacitors may be arranged in a generally circular pattern with the termination centered on the center. The termination may include first and second terminals. The capacitors may be mounted to a printed circuit board (“PCB”) with traces on opposite surfaces of the PCB providing electrical flow paths from the terminals to opposite legs of the capacitors. The capacitor packaging may include a primary PCB with a first circular arrangement of capacitors and a secondary PCB with a second circular arrangement of capacitors. The capacitors may be sandwiched between the PCBs with the second arrangement of capacitors disposed concentrically inwardly of the first arrangement.

公开(公告)号：US20220375691A1

公开(公告)日：2022-11-24

申请号：US17742690

申请日：2022-05-12

申请人： UT-Battelle, LLC

发明人： Shajjad Chowdhury ,  Raj Sahu ,  Emre Gurpinar ,  Burak Ozpineci

IPC分类号： H01G4/38 ,  H05K1/16 ,  H01G4/232

摘要： A capacitor packaging having a central termination and three or more capacitors (or groups of capacitors) arranged about the central termination. The electrical flow paths between the termination and the capacitors or groups of capacitors are of substantially the same length. The capacitors or groups of capacitors may be arranged in a generally circular pattern with the termination centered on the center. The termination may include first and second terminals. The capacitors may be mounted to a printed circuit board (“PCB”) with traces on opposite surfaces of the PCB providing electrical flow paths from the terminals to opposite legs of the capacitors. The capacitor packaging may include a primary PCB with a first circular arrangement of capacitors and a secondary PCB with a second circular arrangement of capacitors. The capacitors may be sandwiched between the PCBs with the second arrangement of capacitors disposed concentrically inwardly of the first arrangement.

公开(公告)号：US20220117109A1

公开(公告)日：2022-04-14

申请号：US17495098

申请日：2021-10-06

申请人： UT-Battelle, LLC

发明人： Raj Sahu ,  Emre Gurpinar ,  Burak Ozpineci

IPC分类号： H05K7/20 ,  G06F30/28

摘要： A system and method for generating a heat sink for circuitry, such as a power module, that facilitates removal of heat from the circuitry. To improve power density of power modules, not only electrical but also thermal optimization may be carried out as the two subsystems closely interact with each other.