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公开(公告)号：US11608546B2
公开(公告)日：2023-03-21
申请号：US16894551
申请日：2020-06-05
申请人： UT-Battelle, LLC , Eck Industries Incorporated , Iowa State University Research Foundation, Inc. , Lawrence Livermore National Security, LLC , University of Tennessee Research Foundation
发明人： Lawrence Allard, Jr. , Sumit Bahl , Ryan Dehoff , Hunter Henderson , Michael Kesler , Scott McCall , Peeyush Nandwana , Ryan Ott , Alex Plotkowski , Orlando Rios , Amit Shyam , Zachary Sims , Kevin Sisco , David Weiss , Ying Yang
摘要： Disclosed herein are embodiments of an Al—Ce—Mn alloy for use in additive manufacturing. The disclosed alloy embodiments provide fabricated objects, such as bulk components, comprising a heterogeneous microstructure and having good mechanical properties even when exposed to conditions used during the additive manufacturing process. Methods for making and using alloy embodiments also are disclosed herein.
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公开(公告)号：US20240269774A1
公开(公告)日：2024-08-15
申请号：US18633192
申请日：2024-04-11
申请人： UT-Battelle, LLC , Eck Industries Incorporated , University of Tennessee Research Foundation , Lawrence Livermore National Security, LLC , Iowa State University Research Foundation, Inc.
发明人： Ryan R. Dehoff , Hunter B. Henderson , Scott McCall , Richard Michi , Peeyush Nandwana , Ryan Ott , Alexander J. Plotkowski , Orlando Rios , Amit Shyam , Zachary C. Sims , Kevin D. Sisco , David Weiss , Ying Yang
IPC分类号： B23K26/342 , B22F9/08 , B23K103/10 , B33Y10/00 , B33Y70/00 , B33Y70/10 , C22C21/00
CPC分类号： B23K26/342 , B33Y10/00 , B33Y70/00 , B33Y70/10 , C22C21/00 , B22F2009/0824 , B22F2301/052 , B22F2304/10 , B23K2103/10
摘要： Disclosed herein are embodiments of an Al—Ce—Ni alloy for use in additive manufacturing. The disclosed alloy embodiments provide fabricated objects, such as bulk components, comprising a heterogeneous microstructure and having good mechanical properties even when exposed to conditions used during the additive manufacturing process. Methods for making and using alloy embodiments also are disclosed herein.
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公开(公告)号：US11705250B2
公开(公告)日：2023-07-18
申请号：US17112726
申请日：2020-12-04
发明人： Scott McCall , Richard Culbertson
CPC分类号： G21F1/085 , C22C27/04 , C22C30/00 , G21F1/125 , H01F1/055 , H01F27/366 , C22C2202/02
摘要： A magnetic shielding material includes a material comprising manganese bismuth (MnBi) and tungsten (W), where a ratio of MnBi:W is in a range of 50:50 to about 70:30. A radiation shielding product includes a part including manganese bismuth (MnBi) and tungsten (W), and a plurality of layers having a defined thickness in a z-direction, wherein each layer extends along an x-y plane perpendicular to the z-direction. At least some of the plurality of layers form a functional gradient in the z-direction and/or along the x-y plane, and the functional gradient is defined by a first layer comprising a ratio of MnBi:W being less than 100:0 and an nth layer above the first layer comprising a ratio of MnBi:W greater than 0:100.
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公开(公告)号：US20210174979A1
公开(公告)日：2021-06-10
申请号：US17112726
申请日：2020-12-04
发明人： Scott McCall , Richard Culbertson
摘要： A magnetic shielding material includes a material comprising manganese bismuth (MnBi) and tungsten (W), where a ratio of MnBi:W is in a range of 50:50 to about 70:30. A radiation shielding product includes a part including manganese bismuth (MnBi) and tungsten (W), and a plurality of layers having a defined thickness in a z-direction, wherein each layer extends along an x-y plane perpendicular to the z-direction. At least some of the plurality of layers form a functional gradient in the z-direction and/or along the x-y plane, and the functional gradient is defined by a first layer comprising a ratio of MnBi:W being less than 100:0 and an nth layer above the first layer comprising a ratio of MnBi:W greater than 0:100.
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