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公开(公告)号：US11145575B2
公开(公告)日：2021-10-12
申请号：US16677595
申请日：2019-11-07
IPC分类号： H01L23/02 , H01L23/34 , H01L23/495 , H01L23/00 , H01L25/00 , H01L25/07 , H01L25/065 , H01L21/56 , H01L23/31
摘要： An embodiment related to a method for forming a device is disclosed. The method includes providing a package substrate having a first die attach pad (DAP) and a first bond pad, forming a first conductive die-substrate bonding layer on the first DAP, and attaching a first major surface of a first die to the first DAP. The first die includes a first die contact pad on a second major surface of the first die. A first conductive clip-die bonding layer with spacers is formed on the first die contact pad of the first die. A first conductive clip-substrate bonding layer is formed on the first bond pad of the package substrate. The method also includes attaching a first clip bond to the first die and the first bond pad. The first clip bond includes a first horizontal planar portion attached to the first die over the first die contact pad and a second vertical portion attached to the first bond pad.
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公开(公告)号：US11710681B2
公开(公告)日：2023-07-25
申请号：US17495788
申请日：2021-10-06
IPC分类号： H01L23/495 , H01L23/31 , H01L25/065 , H01L23/00 , H01L25/00 , H01L25/07 , H01L21/56
CPC分类号： H01L23/49513 , H01L23/3128 , H01L23/49517 , H01L23/49541 , H01L23/49575 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/40 , H01L24/49 , H01L24/83 , H01L24/84 , H01L25/0652 , H01L25/0657 , H01L25/074 , H01L25/50 , H01L21/56 , H01L23/3107 , H01L2224/32245 , H01L2224/8384 , H01L2224/83815 , H01L2224/8484 , H01L2224/84815 , H01L2924/181
摘要： An embodiment related to a device. The device includes a first die with first and second die surfaces. The second die surface is bonded to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad. The device also includes a first clip bond including a first clip bond horizontal planar portion attached to the first die contact pad on the first die surface, and a first clip bond vertical portion disposed on an edge of the first clip bond horizontal planar portion. The first clip bond vertical portion is attached to a first substrate bond pad on the first substrate surface. The device further includes a first conductive clip-die bonding layer with spacers on the first die contact pad of the first die. The first conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the first die contact pad, and the spacers maintain a uniform Bond Line Thickness (BLT) of the first conductive clip-die bonding layer.
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