公开(公告)号：US20210118738A1

公开(公告)日：2021-04-22

申请号：US17072006

申请日：2020-10-15

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Enrique Jr SARILE ,  Dzafir Bin Mohd SHARIFF ,  Seung Geun PARK ,  Ronnie M. DE VILLA ,  Zhong Hai WANG

IPC: H01L21/78 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package is disclosed. The semiconductor package includes a substrate with a first surface, a second surface and sidewalls. The package also includes backside metallization (BSM) over the second surface of the substrate. The semiconductor package is devoid of metal debris.

公开(公告)号：US20210193522A1

公开(公告)日：2021-06-24

申请号：US17125917

申请日：2020-12-17

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Dzafir Bin Mohd SHARIFF ,  Enrique Jr SARILE ,  Seung Geun PARK

IPC: H01L21/78 ,  H01L21/768 ,  H01L23/544

Abstract: A semiconductor package which is free of metal debris from backside metallization (BSM) is disclosed. The semiconductor package is singulated by performing a saw street open process from the frontside of the wafer and then includes a singulation process using a plasma etch from the backside of the wafer with BSM. The singulation process results in metal debris free packages.

公开(公告)号：US20200161351A1

公开(公告)日：2020-05-21

申请号：US16687659

申请日：2019-11-18

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Hua Hong TAN ,  Chee Kay CHOW ,  Thian Hwee TAN ,  Wedanni Linsangan MICLA ,  Enrique Jr SARILE ,  Mario Arwin FABIAN ,  Dennis TRESNADO ,  Antonino II MILANES ,  Ming Koon ANG ,  Kian Soo LIM ,  Mauro Jr. DIONISIO ,  Teddy Joaquin CARREON

IPC: H01L27/146

Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die attach region. A die having first and second major die surfaces is attached onto the die attach region. The second major die surface is attached to the die attach region. The first major die surface includes an die active region and a cover adhesive region surrounding the die active region. The method also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the die active region. The protective cover includes a discontinuity on at least one of the side surfaces. An encapsulant is disposed on the package substrate to cover exposed portions of the package substrate, die and bond wires and side surfaces of the protective cover, while leaving the first major cover surface exposed. The discontinuity enhances adhesion of the encapsulant to the protective cover.