公开(公告)号：US12165921B2

公开(公告)日：2024-12-10

申请号：US17723413

申请日：2022-04-18

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Enrique Sarile, Jr. ,  Chee Kay Chow ,  Dzafir Bin Mohd Shariff

IPC: H01L21/78 ,  B23Q1/03 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683

Abstract: A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A method for forming the wafer adaptor ring assembly is also disclosed.