公开(公告)号：US20230058682A1

公开(公告)日：2023-02-23

申请号：US17454514

申请日：2021-11-11

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Hua Hong Tan ,  Wing Keung Lam ,  Zong Xiang Cai ,  Wei Ming Xian ,  Yao Hong Wu ,  Tao Hu

IPC: B08B1/00 ,  B08B1/02 ,  B08B5/04

Abstract: A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.

公开(公告)号：US11945004B2

公开(公告)日：2024-04-02

申请号：US17454514

申请日：2021-11-11

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Hua Hong Tan ,  Wing Keung Lam ,  Zong Xiang Cai ,  Wei Ming Xian ,  Yao Hong Wu ,  Tao Hu

IPC: B08B1/00 ,  B08B1/02 ,  B08B5/04

CPC classification number: B08B1/002 ,  B08B1/02 ,  B08B5/04 ,  B08B5/043

Abstract: A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.