公开(公告)号：US20210035891A1

公开(公告)日：2021-02-04

申请号：US16942715

申请日：2020-07-29

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Wing Keung LAM ,  Saravuth SIRINORAKUL ,  Kok Chuen LOCK ,  Roel Adeva ROBLES

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L25/16

Abstract: An embodiment related to a stacked package is disclosed. The stacked package includes a conductive gang with gang legs electrically coupling a second component stacked over a first die to a package substrate. The first die is mounted over a die attach region of the package substrate and electrically coupled to the package substrate.