公开(公告)号：US20220028798A1

公开(公告)日：2022-01-27

申请号：US17382283

申请日：2021-07-21

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Saravuth SIRINORAKUL ,  Il Kwon SHIM ,  Kok Chuen LOCK ,  Roel Adeva ROBLES ,  Eakkasit DUMSONG

IPC: H01L23/552 ,  H01L23/36 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/56

Abstract: The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. An integrated shielding structure may be disposed in between the package substrate and the encapsulant to shield internal and/or external EMI. For example, a top surface of the integrated shield structure is exposed.

公开(公告)号：US20210035891A1

公开(公告)日：2021-02-04

申请号：US16942715

申请日：2020-07-29

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Wing Keung LAM ,  Saravuth SIRINORAKUL ,  Kok Chuen LOCK ,  Roel Adeva ROBLES

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L25/16

Abstract: An embodiment related to a stacked package is disclosed. The stacked package includes a conductive gang with gang legs electrically coupling a second component stacked over a first die to a package substrate. The first die is mounted over a die attach region of the package substrate and electrically coupled to the package substrate.