公开(公告)号：US20240121896A1

公开(公告)日：2024-04-11

申请号：US18065606

申请日：2022-12-13

Applicant: Unimicron Technology Corp.

Inventor： Chien Jung CHEN ,  Jia Hao LIANG ,  Ching Ku LIN

IPC: H05K1/11 ,  H05K3/06 ,  H05K3/46

CPC classification number: H05K1/112 ,  H05K3/062 ,  H05K3/4644

Abstract: The present disclosure provides a circuit board including a first circuit layer, a dielectric layer on the first circuit layer, and a seed layer on the dielectric layer and directly contacting the first circuit layer, in which a top surface of the seed layer includes a levelled portion. The circuit board also includes a second circuit layer on the levelled portion of the seed layer, in which a grain boundary density of the second circuit layer is lower than that of a portion of the seed layer directly contacting the first circuit layer.