公开(公告)号：US11134567B1

公开(公告)日：2021-09-28

申请号：US17009790

申请日：2020-09-02

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen ,  I-Ta Tsai ,  Chien-Chih Chen

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/46 ,  H05K1/18

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

公开(公告)号：US11523505B2

公开(公告)日：2022-12-06

申请号：US17406115

申请日：2021-08-19

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen ,  I-Ta Tsai ,  Chien-Chih Chen

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

公开(公告)号：US20220022317A1

公开(公告)日：2022-01-20

申请号：US17406115

申请日：2021-08-19

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen ,  I-Ta Tsai ,  Chien-Chih Chen

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/40 ,  H05K1/18

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.