公开(公告)号：US11134567B1

公开(公告)日：2021-09-28

申请号：US17009790

申请日：2020-09-02

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen ,  I-Ta Tsai ,  Chien-Chih Chen

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/46 ,  H05K1/18

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

公开(公告)号：US11523505B2

公开(公告)日：2022-12-06

申请号：US17406115

申请日：2021-08-19

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen ,  I-Ta Tsai ,  Chien-Chih Chen

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

公开(公告)号：US20220022317A1

公开(公告)日：2022-01-20

申请号：US17406115

申请日：2021-08-19

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen ,  I-Ta Tsai ,  Chien-Chih Chen

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/40 ,  H05K1/18

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

公开(公告)号：US20150366081A1

公开(公告)日：2015-12-17

申请号：US14304979

申请日：2014-06-15

Applicant: Unimicron Technology Corp.

Inventor： I-Ta Tsai

IPC: H05K3/46 ,  H05K3/42 ,  H05K3/30

CPC classification number: H05K1/188 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92244 ,  H05K3/4602 ,  H05K2201/029 ,  H05K2201/10015 ,  H05K2203/1469 ,  Y10T29/303 ,  Y10T29/49131

Abstract: A manufacturing method for a circuit structure embedded with an electronic device including the following steps is provided. A first dielectric material is provided. At least one electronic device is disposed on the first dielectric material. A second dielectric material is laminated on the first dielectric material, and two conductive materials are disposed on the first dielectric material and the second dielectric material respectively, such that the electronic device is embedded between the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are respectively located between the electronic device and the corresponding conductive material, and the first dielectric material, the second dielectric material, the electronic device and the two conductive materials form a core board. An inner-layer circuit is formed on the core board, and the inner-layer circuit is connected with the electronic device.

Abstract translation: 提供了一种嵌有电子设备的电路结构的制造方法，包括以下步骤。 提供第一介电材料。 至少一个电子器件设置在第一电介质材料上。 第二电介质材料层压在第一电介质材料上，并且两个导电材料分别设置在第一电介质材料和第二电介质材料上，使得电子器件嵌入在第一电介质材料和第二电介质材料之间，其中 第一介电材料和第二介电材料分别位于电子器件和相应的导电材料之间，并且第一介电材料，第二介电材料，电子器件和两个导电材料形成芯板。 内层电路形成在芯板上，内层电路与电子设备连接。