公开(公告)号：US10772195B2

公开(公告)日：2020-09-08

申请号：US15980739

申请日：2018-05-16

Applicant: Unimicron Technology Corp.

Inventor： Jun-Jie Chang ,  Shian-Tang Chang ,  Dung-Ying Sung

IPC: B32B3/24 ,  H05K1/02 ,  B23K26/386 ,  H05K3/46 ,  H05K3/00 ,  B23K103/16 ,  B32B3/26

Abstract: A two-dimensional data matrix structure includes a first substrate, a first metal layer disposed on the first substrate, a second substrate disposed on the first metal layer, and a second metal layer disposed on the second substrate. The first metal layer has a plurality of sections and a plurality of empty regions formed according to a two-dimensional data matrix pattern. The first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, and positions of the through holes correspond to positions of the empty regions. The second substrate and the second metal layer commonly have a plurality of blind holes, and positions of the blind holes correspond to positions of the sections. The sections are exposed through the blind holes, and the configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.