公开(公告)号：US11419222B2

公开(公告)日：2022-08-16

申请号：US16784219

申请日：2020-02-06

申请人： Unimicron Technology Corp.

发明人： Hsin-Chi Hu

IPC分类号： H05K3/46 ,  H05K3/42 ,  H05K3/00 ,  H05K1/11 ,  H05K3/24 ,  H05K3/40

摘要： A method of manufacturing a circuit board includes: providing a substrate including a bottom layer and a resin layer over the bottom layer, the resin layer including a first surface in contact with the bottom layer and a second surface opposite to the first surface; forming a plurality of vias through the resin layer; depositing a first metal layer in the vias, the first metal layer filling a portion of each of the vias; depositing a second metal layer over the first metal layer and in the vias; forming a patterned metal layer over the second metal layer and extending from each of the vias to a position over the second surface; separating the bottom layer and the resin layer; and removing a portion of the resin layer from the first surface, so that the first metal layer protrudes from the resin layer.

公开(公告)号：US10602621B1

公开(公告)日：2020-03-24

申请号：US16218508

申请日：2018-12-13

申请人： Unimicron Technology Corp.

发明人： Hsin-Chi Hu

IPC分类号： H05K1/11 ,  H05K3/46 ,  H05K3/42 ,  H05K3/00 ,  H05K3/24 ,  H05K3/40

摘要： A method of manufacturing a circuit board includes: providing a substrate including a bottom layer and a resin layer over the bottom layer, the resin layer including a first surface in contact with the bottom layer and a second surface opposite to the first surface; forming a plurality of vias through the resin layer; depositing a first metal layer in the vias, the first metal layer filling a portion of each of the vias; depositing a second metal layer over the first metal layer and in the vias; forming a patterned metal layer over the second metal layer and extending from each of the vias to a position over the second surface; separating the bottom layer and the resin layer; and removing a portion of the resin layer from the first surface, so that the first metal layer protrudes from the resin layer.