公开(公告)号：US20220022316A1

公开(公告)日：2022-01-20

申请号：US16996911

申请日：2020-08-19

Applicant: Unimicron Technology Corp.

Inventor： Po-Wei Chen ,  Wei-Ti Lin ,  Chun-Hsien Chien

IPC: H05K1/11 ,  H05K3/10 ,  H05K3/46 ,  H05K3/18 ,  H01L23/498

Abstract: A package carrier includes a build-up circuit structure, a first insulation protective layer, a plurality of connection pads, and a plurality of metal balls. The build-up circuit structure has an upper surface. The first insulation protective layer is disposed on the upper surface of the build-up circuit structure and has a plurality of first openings. The connection pads are respectively disposed in the first openings of the first insulation protective layer and are structurally and electrically connected to the build-up circuit structure. Each of the connection pads has an arc-shaped groove. The metal balls are respectively disposed in the arc-shaped groove of the connection pads. The metal balls and the corresponding connection pads define a plurality of bump structures, and a plurality of top surfaces of the bump structures are on a same plane.