公开(公告)号：US10314179B2

公开(公告)日：2019-06-04

申请号：US16013956

申请日：2018-06-21

Applicant: Unimicron Technology Corp.

Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

IPC: H05K3/46

Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

公开(公告)号：US20180302992A1

公开(公告)日：2018-10-18

申请号：US16013956

申请日：2018-06-21

Applicant: Unimicron Technology Corp.

Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

IPC: H05K3/46

CPC classification number: H05K3/4697 ,  H05K3/4644

Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

公开(公告)号：US10051748B2

公开(公告)日：2018-08-14

申请号：US14997583

申请日：2016-01-18

Applicant: Unimicron Technology Corp.

Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

IPC: H05K1/09 ,  H05K3/46

Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.