公开(公告)号：US20200161518A1

公开(公告)日：2020-05-21

申请号：US16281108

申请日：2019-02-21

申请人： Unimicron Technology Corp.

发明人： Yi-Cheng Lin ,  Yu-Hua Chen ,  Chun-Hsien Chien ,  Chien-Chou Chen ,  Cheng-Hui Wu

IPC分类号： H01L33/62 ,  H01L33/52 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31

摘要： A light-emitting diode package including a carrier structure, a patterned conductive layer, at least one chip, a dielectric layer, at least one first conductive via, a build-up circuit structure, and at least one light-emitting diode is provided. The patterned conductive layer is disposed on the carrier structure. The chip is disposed on the carrier structure. The dielectric layer is disposed on the carrier structure and encapsulates the chip and the patterned conductive layer. The first conductive via penetrates the dielectric layer and is electrically connected to the patterned conductive layer. The build-up circuit structure is disposed on the dielectric layer and electrically connected to the first conductive via. The light-emitting diode is disposed on the build-up circuit structure.

公开(公告)号：US11251350B2

公开(公告)日：2022-02-15

申请号：US16281108

申请日：2019-02-21

申请人： Unimicron Technology Corp.

发明人： Yi-Cheng Lin ,  Yu-Hua Chen ,  Chun-Hsien Chien ,  Chien-Chou Chen ,  Cheng-Hui Wu

IPC分类号： H01L33/62 ,  H01L33/52 ,  H01L23/538 ,  H01L23/498 ,  H01L23/31

摘要： A light-emitting diode package including a carrier structure, a patterned conductive layer, at least one chip, a dielectric layer, at least one first conductive via, a build-up circuit structure, and at least one light-emitting diode is provided. The patterned conductive layer is disposed on the carrier structure. The chip is disposed on the carrier structure. The dielectric layer is disposed on the carrier structure and encapsulates the chip and the patterned conductive layer. The first conductive via penetrates the dielectric layer and is electrically connected to the patterned conductive layer. The build-up circuit structure is disposed on the dielectric layer and electrically connected to the first conductive via. The light-emitting diode is disposed on the build-up circuit structure.