公开(公告)号：US10820411B1

公开(公告)日：2020-10-27

申请号：US16879951

申请日：2020-05-21

Applicant: Unimicron Technology Corporation

Inventor： Shih-Lian Cheng ,  Zhe-Yong Lin ,  Li-Jie Liu ,  Ching Sheng Chen

IPC: H05K1/02 ,  H05K3/02 ,  H05K1/09 ,  H05K3/06

Abstract: A manufacturing method for a circuit board and a circuit board are provided. The method includes steps: providing a substrate having a first metal layer; forming a patterned first opening on the first metal layer to expose the substrate; forming a patterned first dielectric layer on the substrate, the first dielectric layer is made of a photosensitive dielectric material and covers the first opening; photosensitizing the first dielectric layer to cure the first dielectric layer; forming a patterned second metal layer on the first metal layer; forming a patterned third metal layer on the second metal layer, and the third metal layer being adjacent to the first dielectric layer; removing a portion of the first metal layer not covered by the second metal layer; and forming a second dielectric layer on the substrate. A thickness of the third metal layer is greater than a thickness of the second metal layer.