-
公开(公告)号：US10820411B1
公开(公告)日：2020-10-27
申请号：US16879951
申请日：2020-05-21
Applicant: Unimicron Technology Corporation
Inventor： Shih-Lian Cheng , Zhe-Yong Lin , Li-Jie Liu , Ching Sheng Chen
Abstract: A manufacturing method for a circuit board and a circuit board are provided. The method includes steps: providing a substrate having a first metal layer; forming a patterned first opening on the first metal layer to expose the substrate; forming a patterned first dielectric layer on the substrate, the first dielectric layer is made of a photosensitive dielectric material and covers the first opening; photosensitizing the first dielectric layer to cure the first dielectric layer; forming a patterned second metal layer on the first metal layer; forming a patterned third metal layer on the second metal layer, and the third metal layer being adjacent to the first dielectric layer; removing a portion of the first metal layer not covered by the second metal layer; and forming a second dielectric layer on the substrate. A thickness of the third metal layer is greater than a thickness of the second metal layer.
-
公开(公告)号：US20140263168A1
公开(公告)日：2014-09-18
申请号：US14088782
申请日：2013-11-25
Applicant: Unimicron Technology Corporation
Inventor： Shih-Lian Cheng , Jui-Jung Chien
CPC classification number: H05K3/0017 , H01L21/486 , H05K3/107 , H05K2201/0376 , H05K2201/09036
Abstract: A method for manufacturing a package substrate is provided, including etching a substrate to form trenches each having a buffer portion, and forming a circuit in each of the trenches. The trenches are formed by etching instead of excimer laser to increase the aspect ratio of the trench, thereby solving the problem that the metallic layer is not thick enough and achieving a high yield of the circuit and a good process capability index.
Abstract translation: 提供了一种制造封装衬底的方法，包括蚀刻衬底以形成各自具有缓冲部分的沟槽，并且在每个沟槽中形成电路。 通过蚀刻而不是准分子激光形成沟槽，以增加沟槽的纵横比，从而解决了金属层不够厚并且实现电路的高产率和良好的工艺能力指数的问题。
-
Search Results
2
records
(took 0.009 seconds)
