公开(公告)号：US20240038684A1

公开(公告)日：2024-02-01

申请号：US17889389

申请日：2022-08-16

Applicant: United Microelectronics Corp.

Inventor： Ming-Hua Tsai ,  Hao Ping Yan ,  Chin-Chia Kuo ,  Wei Hsuan Chang

IPC: H01L23/00 ,  H01L23/544 ,  H01L23/58

CPC classification number: H01L23/562 ,  H01L23/544 ,  H01L23/564 ,  H01L23/585 ,  H01L2223/5446 ,  H01L2223/54426

Abstract: A semiconductor structure including a substrate and protection structures is provided. The substrate includes a die region. The die region includes corner regions. The protection structures are located in the corner region. Each of the protection structures has a square top-view pattern. The square top-view patterns located in the same corner region have various sizes.