公开(公告)号：US10109474B1

公开(公告)日：2018-10-23

申请号：US15603046

申请日：2017-05-23

Applicant: United Microelectronics Corp.

Inventor： Wei-Jin Wang ,  Zhi-Biao Zhou

IPC: H01L21/00 ,  H01L21/02 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/60

Abstract: A method for fabricating handling wafer includes providing a substrate, having a front side and a back side. The front side of the substrate is disposed on a supporting pin. A first oxide layer is formed surrounding the substrate. A portion of the first oxide layer is removed to expose the front side of the substrate. An alignment mark is formed on the front side of the substrate.