公开(公告)号：US08890250B2

公开(公告)日：2014-11-18

申请号：US13729037

申请日：2012-12-28

Applicant: United Microelectronics Corporation

Inventor： Chang-Tzu Wang ,  Yu-Chun Chen ,  Tien-Hao Tang

IPC: H01L23/62 ,  H01L29/739

CPC classification number: H01L29/0626 ,  H01L29/1083 ,  H01L29/7436 ,  H01L29/7835

Abstract: An electrostatic discharge protection structure includes a semiconductor substrate, a first well region, a gate structure, a second well region, a second well region, a second conductive region, and a deep well region. The first well region contains first type conducting carriers. The second well region is disposed within the first well region, and contains second type conducting carriers. The first conductive region is disposed on the surface of the first well region, and contains the second type conducting carriers. The deep well region is disposed under the second well region and the first conductive region, and contacted with the second well region. The deep well region contains the second type conducting carriers.

Abstract translation: 静电放电保护结构包括半导体衬底，第一阱区，栅极结构，第二阱区，第二阱区，第二导电区和深阱区。 第一阱区域包含第一类导电载体。 第二阱区域设置在第一阱区域内，并且包含第二类型的导电载体。 第一导电区域设置在第一阱区域的表面上，并且包含第二导电载体。 深阱区域设置在第二阱区域和第一导电区域下方，并与第二阱区域接触。 深井区域包含第二类导电载体。

公开(公告)号：US09627210B2

公开(公告)日：2017-04-18

申请号：US15159816

申请日：2016-05-20

Applicant: UNITED MICROELECTRONICS CORPORATION

Inventor： Chang-Tzu Wang ,  Yu-Chun Chen ,  Tien-Hao Tang

IPC: H01L21/266 ,  H01L21/265 ,  H01L23/60 ,  H01L27/02

CPC classification number: H01L21/266 ,  H01L21/265 ,  H01L23/60 ,  H01L27/0277 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of fabricating an electrostatic discharge protection structure includes the following steps. Firstly, a semiconductor substrate is provided. Plural isolation structures, a well region, a first conductive region and a second conductive region are formed in the semiconductor substrate. The well region contains first type conducting carriers. The first conductive region and the second conductive region contain second type conducting carriers. Then, a mask layer is formed on the surface of the semiconductor substrate, wherein a part of the first conductive region is exposed. Then, a first implantation process is performed to implant the second type conducting carriers into the well region by using the mask layer as an implantation mask, so that a portion of the first type conducting carriers of the well region is electrically neutralized and a first doped region is formed under the exposed part of the first conductive region.

公开(公告)号：US09378958B2

公开(公告)日：2016-06-28

申请号：US13729034

申请日：2012-12-28

Applicant: UNITED MICROELECTRONICS CORPORATION

Inventor： Chang-Tzu Wang ,  Yu-Chun Chen ,  Tien-Hao Tang

IPC: H01L23/60 ,  H01L21/265 ,  H01L27/02

CPC classification number: H01L21/266 ,  H01L21/265 ,  H01L23/60 ,  H01L27/0277 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of fabricating an electrostatic discharge protection structure includes the following steps. Firstly, a semiconductor substrate is provided. Plural isolation structures, a well region, a first conductive region and a second conductive region are formed in the semiconductor substrate. The well region contains first type conducting carriers. The first conductive region and the second conductive region contain second type conducting carriers. Then, a mask layer is formed on the surface of the semiconductor substrate, wherein a part of the first conductive region is exposed. Then, a first implantation process is performed to implant the second type conducting carriers into the well region by using the mask layer as an implantation mask, so that a portion of the first type conducting carriers of the well region is electrically neutralized and a first doped region is formed under the exposed part of the first conductive region.

Abstract translation: 一种制造静电放电保护结构的方法包括以下步骤。 首先，提供半导体衬底。 在半导体衬底中形成多个隔离结构，阱区，第一导电区和第二导电区。 阱区包含第一类导电载体。 第一导电区域和第二导电区域包含第二导电载体。 然后，在半导体衬底的表面上形成掩模层，其中露出第一导电区域的一部分。 然后，通过使用掩模层作为注入掩模，执行第一注入工艺以将第二类型导电载体注入阱区，使得阱区的第一类导电载体的一部分被电中和，并且第一掺杂 区域形成在第一导电区域的暴露部分下方。