公开(公告)号：US20240052474A1

公开(公告)日：2024-02-15

申请号：US18228892

申请日：2023-08-01

Applicant: Universal Display Corporation

Inventor： William E. QUINN ,  Gregory MCGRAW ,  Craig Anthony OUTTEN ,  Roman KOROTKOV ,  Seckin GOKALTUN

IPC: C23C14/04

CPC classification number: C23C14/04 ,  H10K71/135

Abstract: Devices suitable for use in OVJP and similar deposition techniques are provided that include multiple delivery apertures that are uncoupled from one another, allowing for more plateau-like deposition profiles. Fabrication techniques for such devices are also provided in which multiple wafers are etched and laminated to one another to form a monolithic depositor block.