公开(公告)号：US20190036214A1

公开(公告)日：2019-01-31

申请号：US15959305

申请日：2018-04-23

Applicant: University of Electronic Science and Technology of China

Inventor： Yujian CHENG ,  Yichen ZHONG ,  Renbo HE ,  Yan LIU ,  Yong FAN ,  Kaijun SONG ,  Bo ZHANG ,  Xianqi LIN ,  Yonghong ZHANG

IPC: H01Q3/30 ,  H01Q19/06 ,  H01Q13/02 ,  H01Q3/14

Abstract: An antenna for generating an arbitrarily directed Bessel beam, including a beam-forming plane and a feeding horn, the beam-forming plane is a dual-layer dielectric substrate structure having a beam focusing function, including: a printed circuit bottom layer, a high-frequency dielectric substrate lower layer, a printed circuit middle layer, a high-frequency dielectric substrate upper layer, and, a printed circuit upper layer; the printed circuit bottom layer, the high-frequency dielectric substrate lower layer, the printed circuit middle layer, the high-frequency dielectric substrate upper layer, and the printed circuit upper layer are co-axially stacked from the bottom to the top: the beam-forming plane is entirely divided into periodically arranged beam-forming units by a plurality of meshes, and each beam-forming unit consists of printed circuit upper, middle and lower metal patches of which centers are on the same longitudinal axis, the high-frequency dielectric substrate lower layer and the high-frequency dielectric substrate upper layer.

公开(公告)号：US20200076086A1

公开(公告)日：2020-03-05

申请号：US16556258

申请日：2019-08-30

Applicant: University of Electronic Science and Technology of China

Inventor： Yujian CHENG ,  Yanran DING ,  Jinfan ZHANG ,  Chunxu BAI ,  Yong FAN ,  Kaijun SONG ,  Xianqi LIN ,  Bo ZHANG

IPC: H01Q13/10 ,  H01P3/12 ,  H01Q21/00 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q21/06

Abstract: A shared-aperture antenna includes a first copper metal layer; a second copper metal layer; and a dielectric substrate layer sandwiched between the first copper metal layer and the second copper metal layer. The dielectric substrate layer includes a plurality of metallized vias. The first copper metal layer is in communication with the second copper metal layer via the plurality of metallized vias. The plurality of metallized vias includes first metallized vias forming an inner circular ring and second metallized vias forming an outer circular ring with respect to the center of the antenna. The first copper metal layer, the dielectric substrate layer, the second copper metal layer, and the first metallized vias form a substrate integrated waveguide (SIW) circular cavity slot antenna. The first copper metal layer, the dielectric substrate layer, the second copper metal layer, the first metallized vias and the second metallized vias form a coaxial cavity slot antenna.

公开(公告)号：US20190326679A1

公开(公告)日：2019-10-24

申请号：US16386296

申请日：2019-04-17

Applicant: University of Electronic Science and Technology of China

Inventor： Yujian CHENG ,  Yafei WU ,  Jinfan ZHANG ,  Fan ZHAO ,  Chunxu BAI ,  Yong FAN ,  Kaijun SONG ,  Bo ZHANG ,  Xianqi LIN ,  Yonghong ZHANG

IPC: H01Q13/22 ,  H01Q21/06 ,  H01Q1/50 ,  H01P3/08 ,  H01P3/12 ,  H01P5/08 ,  H01Q1/38

Abstract: A slot array antenna including a smooth curved surface and planar feed structures which are respectively disposed at two ends of the smooth curved surface and are tangent to the smooth curved surface. The smooth curved surface includes at least two arcs mutually connected by smooth transition. The at least two arcs each includes an upper copper metal layer, a lower copper metal layer, and a dielectric substrate layer between the upper and lower copper metal layers. The upper copper metal layer includes radiating slots, and the adjacent radiating slots in a linear array have opposite offsets along the center line of the slot array antenna. The dielectric substrate layer includes metallic vias symmetrically arranged on both sides of the central line of the antenna to form a substrate integrated waveguide.