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公开(公告)号:US11772791B2
公开(公告)日:2023-10-03
申请号:US16353720
申请日:2019-03-14
Applicant: Unmanned Systems and Solutions, LLC
Inventor: Chris Broberg , Manuel Lago , Ted Kempgens , Paul Corry
IPC: B64C39/02 , H02G11/02 , H02J9/06 , H05K7/20 , B66D1/60 , H05K7/14 , B66D1/56 , B66D1/36 , B64F3/02 , H04W84/04
CPC classification number: B64C39/022 , B64C39/024 , B64F3/02 , B66D1/36 , B66D1/56 , B66D1/60 , H02G11/02 , H02J9/061 , H05K7/1427 , H05K7/209 , B64U2201/202 , H04W84/042
Abstract: UAV tether systems are provided that reliably deploy and retract cables capable of high-power and high-bandwidth data transmission. The tether system spools cables in a single layer to promote heat dissipation thereby allowing the use of lower-diameter cables. The tether systems further utilize a lightweight converter that achieves a high-voltage power transmission across a cable that is stepped down to a plurality of lower-voltage outputs usable by a UAV and accompanying payloads. The converter is constructed in a manner that promotes heat dissipation through the use of multi-layer PCBs and separate power modules PCBs mounted above main PCBs to create a cavity where forced air can reach heat sinks affixed to the power modules that extend into the cavity.
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公开(公告)号:US20190283869A1
公开(公告)日:2019-09-19
申请号:US16353720
申请日:2019-03-14
Applicant: Unmanned Systems and Solutions, LLC
Inventor: Chris Broberg , Manuel Lago , Ted Kempgens , Paul Corry
Abstract: UAV tether systems are provided that reliably deploy and retract cables capable of high-power and high-bandwidth data transmission. The tether system spools cables in a single layer to promote heat dissipation thereby allowing the use of lower-diameter cables. The tether systems further utilize a lightweight converter that achieves a high-voltage power transmission across a cable that is stepped down to a plurality of lower-voltage outputs usable by a UAV and accompanying payloads. The converter is constructed in a manner that promotes heat dissipation through the use of multi-layer PCBs and separate power modules PCBs mounted above main PCBs to create a cavity where forced air can reach heat sinks affixed to the power modules that extend into the cavity.
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