公开(公告)号：US11217708B2

公开(公告)日：2022-01-04

申请号：US16890736

申请日：2020-06-02

申请人： Vanguard International Semiconductor Corporation

发明人： Shih-Hao Liu ,  Chung-Ren Lao ,  Chih-Cherng Liao ,  Wu-Hsi Lu ,  Ming-Cheng Lo ,  Wei-Lun Chung ,  Chih-Wei Lin

IPC分类号： H01L31/02 ,  H01L31/0216 ,  H01L31/0352 ,  H01L31/18 ,  H01L31/0236

摘要： An optical sensor includes a substrate, a first/second/third well disposed in a sensing region, a deep trench isolation structure, and a passivation layer. The substrate has a first conductivity type and includes the sensing region. The first well has a second conductivity type and a first depth. The second well has the second conductivity type and a second depth. The third well has the first conductivity type and a third depth. The deep trench isolation structure is disposed in the substrate and surrounding the sensing region, wherein the depth of the deep trench isolation structure is greater than the first depth, the first depth is greater than the second depth, and the second depth is greater than the third depth. The passivation layer is disposed over the substrate, wherein the passivation layer includes a plurality of protruding portions disposed directly above the sensing region.

公开(公告)号：US11335717B2

公开(公告)日：2022-05-17

申请号：US16361853

申请日：2019-03-22

申请人： Vanguard International Semiconductor Corporation

发明人： Chung-Ren Lao ,  Chih-Cherng Liao ,  Shih-Hao Liu ,  Wu-Hsi Lu ,  Ming-Cheng Lo ,  Wei-Lun Chung ,  Chih-Wei Lin

IPC分类号： H01L27/146 ,  G02B27/30 ,  H01L31/173

摘要： A semiconductor device is provided. The semiconductor device includes a substrate and a light-collimating layer. The substrate has a plurality of pixels. The light-collimating layer is disposed on the substrate, and the light-collimating layer includes a transparent material layer, a first light-shielding layer, a second light-shielding layer and a plurality of transparent pillars. The transparent material layer covers the pixels. The first light-shielding layer is disposed on the substrate and the first light-shielding layer has a plurality of holes corresponding to the pixels. The second light-shielding layer is disposed on the first light-shielding layer. The transparent pillars are disposed in the second light-shielding layer.

公开(公告)号：US11637139B2

公开(公告)日：2023-04-25

申请号：US17719918

申请日：2022-04-13

申请人： Vanguard International Semiconductor Corporation

发明人： Chung-Ren Lao ,  Chih-Cherng Liao ,  Shih-Hao Liu ,  Wu-Hsi Lu ,  Ming-Cheng Lo ,  Wei-Lun Chung ,  Chih-Wei Lin

IPC分类号： H01L27/146 ,  G02B27/30 ,  H01L31/173

摘要： A semiconductor device is provided. The semiconductor device includes a substrate and a light-collimating layer. The substrate has a plurality of pixels. The light-collimating layer is disposed on the substrate, and the light-collimating layer includes a transparent material layer, a first light-shielding layer, a second light-shielding layer and a plurality of transparent pillars. The transparent material layer covers the pixels. The first light-shielding layer is disposed on the substrate and the first light-shielding layer has a plurality of holes corresponding to the pixels. The second light-shielding layer is disposed on the first light-shielding layer. The transparent pillars are disposed in the second light-shielding layer.

公开(公告)号：US11538840B2

公开(公告)日：2022-12-27

申请号：US16541889

申请日：2019-08-15

申请人： VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION

发明人： Wu-Hsi Lu ,  Chung-Ren Lao ,  Chih-Cherng Liao ,  Shih-Hao Liu ,  Ming-Cheng Lo ,  Wei-Lun Chung

IPC分类号： H01L27/146 ,  G06V40/10

摘要： A semiconductor device includes a conductive substrate and an encapsulation structure. The conductive substrate has a plurality of pixels. The encapsulation structure is disposed on the conductive substrate and includes at least one light-collimating unit. The light-collimating unit includes a transparent substrate and a patterned light-shielding layer. The patterned light-shielding layer is disposed on the transparent substrate. The patterned light-shielding layer has a plurality of holes disposed to correspond to the pixels.

公开(公告)号：US20220238584A1

公开(公告)日：2022-07-28

申请号：US17719918

申请日：2022-04-13

申请人： Vanguard International Semiconductor Corporation

发明人： Chung-Ren Lao ,  Chih-Cherng Liao ,  Shih-Hao Liu ,  Wu-Hsi Lu ,  Ming-Cheng Lo ,  Wei-Lun Chung ,  Chih-Wei Lin

IPC分类号： H01L27/146 ,  G02B27/30

摘要： A semiconductor device is provided. The semiconductor device includes a substrate and a light-collimating layer. The substrate has a plurality of pixels. The light-collimating layer is disposed on the substrate, and the light-collimating layer includes a transparent material layer, a first light-shielding layer, a second light-shielding layer and a plurality of transparent pillars. The transparent material layer covers the pixels. The first light-shielding layer is disposed on the substrate and the first light-shielding layer has a plurality of holes corresponding to the pixels. The second light-shielding layer is disposed on the first light-shielding layer. The transparent pillars are disposed in the second light-shielding layer.

公开(公告)号：US20210050378A1

公开(公告)日：2021-02-18

申请号：US16541889

申请日：2019-08-15

申请人： VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION

发明人： Wu-Hsi Lu ,  Chung-Ren Lao ,  Chih-Cherng Liao ,  Shih-Hao Liu ,  Ming-Cheng Lo ,  Wei-Lun Chung

IPC分类号： H01L27/146 ,  G06K9/00

摘要： A semiconductor device includes a conductive substrate and an encapsulation structure. The conductive substrate has a plurality of pixels. The encapsulation structure is disposed on the conductive substrate and includes at least one light-collimating unit. The light-collimating unit includes a transparent substrate and a patterned light-shielding layer. The patterned light-shielding layer is disposed on the transparent substrate. The patterned light-shielding layer has a plurality of holes disposed to correspond to the pixels.