Thin electronic chip card and method of making same
    1.
    发明申请
    Thin electronic chip card and method of making same 有权
    薄电子芯片卡及其制作方法

    公开(公告)号:US20040182939A1

    公开(公告)日:2004-09-23

    申请号:US10766367

    申请日:2004-01-28

    IPC分类号: G06K019/06

    摘要: A thin electronic chip card with an IC chip and a galvanic element as an energy store, which has at least one lithium-intercalating electrode and has a thin, flexible housing comprising two metal foils, which bear directly against the electrodes and are connected to each other in a sealed manner with an adhesive or sealing layer, the element is arranged in a recess in the chip card and the chip card and the element are covered on both sides by an overlay plastic film, which is firmly bonded to the chip card and the element with an elastic stress-compensating adhesive, which adheres simultaneously on metals and plastics.

    摘要翻译: 一种具有IC芯片和电流元件作为能量存储器的薄电子芯片卡,其具有至少一个锂嵌入电极,并且具有薄的柔性壳体,其包括两个金属箔,其直接抵靠电极并连接到每个 另外以密封的方式用粘合剂或密封层,该元件布置在芯片卡的凹槽中,并且芯片卡和元件被覆盖塑料膜两侧覆盖,该覆盖塑料膜牢固地结合到芯片卡和 该元件具有弹性应力补偿粘合剂,其同时粘附在金属和塑料上。

    Electrochemical element
    2.
    发明申请
    Electrochemical element 审中-公开
    电化学元素

    公开(公告)号:US20030232241A1

    公开(公告)日:2003-12-18

    申请号:US10457109

    申请日:2003-06-09

    IPC分类号: H01M002/02 H01M002/08

    摘要: An electrochemical element has at least one lithium-intercalating electrode and a thin flexible housing composed of two metal sheets, which rest directly on the electrodes and are connected to one another in a sealing manner via an adhesive or sealing layer. At least one of the metal sheets is provided on the outside with a plastic layer, which increases the robustness and strength. An adhesion layer is arranged between the metal sheet and the plastic layer. The metal sheet is composed, for example, of copper. The plastic layer is composed, for example, of polyimide. The adhesion layer is based, for example, on rubber.

    摘要翻译: 电化学元件具有至少一个锂嵌入电极和由两个金属片组成的薄的柔性壳体,两个金属片材直接放置在电极上并且通过粘合剂或密封层以密封方式彼此连接。 至少一个金属片在外部设置有塑料层,这提高了坚固性和强度。 在金属片和塑料层之间设置粘合层。 金属片例如由铜构成。 塑料层例如由聚酰亚胺构成。 粘合层基于例如橡胶。