公开(公告)号：US12108519B2

公开(公告)日：2024-10-01

申请号：US17783871

申请日：2020-12-02

Applicant: Valeo Systemes Thermiques

Inventor： Ismaël Franco ,  Biagio Provinzano ,  Onur Tas

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/30 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K3/30 ,  H05K7/2039

Abstract: Disclosed is an assembly (11) of an electronic board (22) and a heat sink (24), in particular for a motor-fan unit (10) of a motor vehicle, comprising an electronic board (22); a heat sink (24) comprising a plate (28) fastened to the electronic board (22), the surface of which has through-openings (30); and a thermal paste (26) arranged between the electronic board (22) and the plate (28).

公开(公告)号：US20230011304A1

公开(公告)日：2023-01-12

申请号：US17783871

申请日：2020-12-02

Applicant: Valeo Systemes Thermiques

Inventor： Ismaël Franco ,  Biagio Provinzano ,  Onur Tas

IPC: H05K1/02 ,  H05K7/20 ,  H05K3/30

Abstract: Disclosed is an assembly (11) of an electronic board (22) and a heat sink (24), in particular for a motor-fan unit (10) of a motor vehicle, comprising an electronic board (22); a heat sink (24) comprising a plate (28) fastened to the electronic board (22), the surface of which has through-openings (30); and a thermal paste (26) arranged between the electronic board (22) and the plate (28).