公开(公告)号：US20230299474A1

公开(公告)日：2023-09-21

申请号：US17655478

申请日：2022-03-18

Applicant: VIAVI SOLUTIONS INC.

Inventor： Thomas SEVILLA

IPC: H01Q1/52 ,  H01Q1/24

CPC classification number: H01Q1/52 ,  H01Q1/243

Abstract: An example antenna monitoring device according to the disclosed principles is provided with an intermodulation distortion mitigation component. An example intermodulation distortion mitigation component may include a backplate for the antenna monitoring device. The back plate may be made of a substance such as aluminum and may be relatively thin (e.g., in the order of 0.5 mm thickness). When the antenna receives signals, the backplate may block signals with intermodulation distortions from reaching the antenna. When the antenna is to transmit signals, the backplate may block the transmitted signals passing through the antenna monitoring device thereby avoiding the introduction of intermodulation distortion.

公开(公告)号：US20240250420A1

公开(公告)日：2024-07-25

申请号：US18426887

申请日：2024-01-30

Applicant: Viavi Solutions Inc.

Inventor： Thomas SEVILLA

IPC: H01Q1/52 ,  H01Q1/24

CPC classification number: H01Q1/52 ,  H01Q1/243

Abstract: An example antenna monitoring device according to the disclosed principles is provided with an intermodulation distortion mitigation component. An example intermodulation distortion mitigation component may include a backplate for the antenna monitoring device. The back plate may be made of a substance such as aluminum and may be relatively thin (e.g., in the order of 0.5 mm thickness). When the antenna receives signals, the backplate may block signals with intermodulation distortions from reaching the antenna. When the antenna is to transmit signals, the backplate may block the transmitted signals passing through the antenna monitoring device thereby avoiding the introduction of intermodulation distortion.

公开(公告)号：US20230117595A1

公开(公告)日：2023-04-20

申请号：US17505162

申请日：2021-10-19

Applicant: Viavi Solutions Inc.

Inventor： Raleigh Benton STELLE, IV ,  Thomas SEVILLA

IPC: H01Q1/12 ,  G08B7/06 ,  G08B21/18 ,  G01L1/22 ,  G01P15/00 ,  G01L5/00

Abstract: An example smart antenna mount may couple an antenna alignment device with an antenna. The smart antenna mount may include sensors such as strain gauges and accelerometers, and an electronic circuitry to communicate the measurements from the sensors. The measurements are received by the antenna alignment device, which may perform further operations to determine whether the coupling is within desired bounds. If within desired bounds, the antenna alignment device may generate an indication of a normal coupling, e.g., by activating a first colored (e.g., green) LED. If the coupling is outside the desired bounds, the antenna alignment device may indicate an alarm condition, e.g., activating a second colored (e.g., red) LED or generating an audible signal.

公开(公告)号：US20230109841A1

公开(公告)日：2023-04-13

申请号：US17500521

申请日：2021-10-13

Applicant: Viavi Solutions Inc.

Inventor： Raleigh Benton STELLE, IV ,  Thomas SEVILLA

IPC: G01S19/26 ,  H01Q3/04 ,  G01C17/28

Abstract: An antenna alignment apparatus may include magnetic field sensors as an alternative to or in addition to GNSS sensors. The magnetic field sensors may measure the earth's magnetic fields at corresponding locations, and a processor may use the measurements to calculate at least one of a roll, tilt, or azimuth of an antenna. For an optical alignment, the antenna alignment apparatus may, additionally or alternately, include a reference object (e.g., a printed mark or a physical stud) located within a field of view of a camera. A location of the reference object may indicate the alignment of the antenna vis-a-vis the structures within the field of view.

公开(公告)号：US20250087876A1

公开(公告)日：2025-03-13

申请号：US18464586

申请日：2023-09-11

Applicant: Viavi Solutions Inc.

Inventor： Raleigh B. STELLE, IV ,  Thomas SEVILLA

IPC: H01Q3/08 ,  G01P15/18

Abstract: Multiple and diverse sensors may be used for antenna monitoring devices. MEMS sensors, electrolytic tilt sensors, thermal mass accelerometers, and/or any other types of tilt sensors may be used. Out of the multiple, diverse tilt sensors, a first sensor (or a first set of sensors) may be used for a first measurement and a second sensor (or a second set of sensors) may be used for augmenting or validating the first measurement. As another example, the second sensor (or the second set of sensors) may be used for correcting errors in the first measurement.

公开(公告)号：US20250066187A1

公开(公告)日：2025-02-27

申请号：US18456222

申请日：2023-08-25

Applicant: Viavi Solutions Inc.

Inventor： Thomas SEVILLA ,  Raleigh B. STELLE, IV

IPC: B81B7/00

Abstract: Temperature stabilization systems and methods for MEMS sensors are disclosed. In an example, a temperature stabilization system may include heating and or cooling components within a printed circuit board (PCB) that holds a MEMS sensor. For example, a resistance heating wire can be used as a heating component and a Peltier device may be used as a heating and or a cooling component. Temperature sensors may be placed on the MEMS sensor itself and or the external environment and the measurements from the temperature sensors can be used to run a feedback loop to the keep the MEMS sensors within a desired temperature range through the use of the heating and or the cooling components.