THIN-FILM DEVICES AND FABRICATION

    公开(公告)号:US20210191212A1

    公开(公告)日:2021-06-24

    申请号:US17195521

    申请日:2021-03-08

    Applicant: View, Inc.

    Abstract: Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

    Thin-film devices and fabrication

    公开(公告)号:US10606142B2

    公开(公告)日:2020-03-31

    申请号:US15109624

    申请日:2014-12-31

    Abstract: Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

    METAL ACCRETION BUS BARS
    4.
    发明申请

    公开(公告)号:US20190094643A1

    公开(公告)日:2019-03-28

    申请号:US16081867

    申请日:2017-03-08

    Applicant: View, Inc.

    Abstract: Electrochromic devices such as electrochromic windows may employ accretively deposited bus bars. Forming bus bars by accretive deposition rather than by conductive inks can reduce fabrication time and costs. Accretive deposition processes may be implemented with high throughput to create highly conductive pure metal and/or alloy features that have good surface adhesion to a substrate such as glass or a transparent conducting layer. Accretive deposition may be used to mechanically and/or electrically bond a wire to a bus bar. In some processes, deposition is primarily ballistic, and particles ejected from a nozzle are deposited by mechanical or metallurgical bonding upon impact. In some cases, particles are heated via a gas or plasma before impacting a substrate.

    THIN-FILM DEVICES AND FABRICATION
    6.
    发明申请

    公开(公告)号:US20160334688A1

    公开(公告)日:2016-11-17

    申请号:US15109624

    申请日:2014-12-31

    Applicant: View, Inc.

    CPC classification number: G02F1/153 G02F1/1523

    Abstract: Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

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