公开(公告)号：US06972244B1

公开(公告)日：2005-12-06

申请号：US10831390

申请日：2004-04-23

申请人： Viraj A. Patwardhan ,  Nikhil Vishwanath Kelkar ,  You Chye How ,  Tian Oon Goh ,  Soi Chong Low

发明人： Viraj A. Patwardhan ,  Nikhil Vishwanath Kelkar ,  You Chye How ,  Tian Oon Goh ,  Soi Chong Low

IPC分类号： H01L21/301 ,  H01L21/46 ,  H01L21/68 ,  H01L21/78 ,  H01L23/544

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/544 ,  H01L24/27 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599

摘要： Wafer level techniques for marking the back surfaces of integrated circuit devices are described. The back surface of the wafer is laser marked while being supported by a mount tape. In some embodiments, the mount tape is sufficiently transparent that the laser light passes through the mount tape and marks the back surface of the wafer. In other embodiments, the laser may actually burn the mounting tape (or portions thereof) during the marking process. The marking may be done on any suitable back surface material including polymeric backcoatings, metalized films or directly on semiconductor materials.

摘要翻译： 描述了用于标记集成电路器件的背面的晶片级技术。 在由安装带支撑的同时激光标记晶片的背面。 在一些实施例中，安装带足够透明，使得激光穿过安装带并标记晶片的背面。 在其它实施例中，在标记过程中，激光器实际上可燃烧安装带（或其部分）。 标记可以在包括聚合物背涂层，金属化膜或直接在半导体材料上的任何合适的背面材料上进行。