A METHOD FOR PREPARING POLYORGANOSILOXANES

    公开(公告)号:US20220227944A1

    公开(公告)日:2022-07-21

    申请号:US17608518

    申请日:2019-05-06

    申请人: WACKER CHEMIE AG

    摘要: The present disclosure relates to a method for preparing polyorganosiloxanes, comprising the following steps: a) reacting together a hydroxyl-terminated polysiloxane and a dialkoxysilane or an oligomer thereof in the presence of Catalyst 1, and b) reacting the product of Step a) with an endcapper in the presence of Catalyst 2 to form the polyorganosiloxane. According to this method, poly-organosiloxanes with an appropriate degree of the polymerization and viscosity are prepared by the polycondensation and equilibration reactions sequentially, and can significantly reduce the viscosity, and improve the flowability and thermal conductivity of the resulting silicone compositions, compared with other polysiloxanes at the same high thermally conductive filler loading.

    POLYORGANOSILOXANE AND THERMALLY CONDUCTIVE SILICONE COMPOSITION THEREOF

    公开(公告)号:US20220220259A1

    公开(公告)日:2022-07-14

    申请号:US17608476

    申请日:2019-05-06

    申请人: WACKER CHEMIE AG

    摘要: The present disclosure relates to a polyorganosiloxane comprising the following structural formula: X—[Si(R1)2O]—[Si(R2)2O]m—[SiR2CaH2a+1O]n—[Si(R1)2]—X, where a is an arbitrary integer between 6 and 18, n is an arbitrary number between 0.7 and 20, m is an arbitrary number between 10 and 1500, m/n is an arbitrary number greater than 20, R1 or R2 is a C1-C5 alkyl group, X represents one or more groups selected from among C2-C6 alkenyl, alkoxy, hydroxyl and hydrogen. The polyorganosiloxane can significantly lower the viscosity, and improve the flowability and processability, of the resulting silicone composition, compared with other polyorganosiloxanes at the same thermally conductive filler loading. Meanwhile, for thermally conductive silicone compositions with the same viscosity, the polyorganosiloxane used as the base polymer can accept a significantly higher level of the thermally conductive fillers, thereby improving their thermal conductivity.