公开(公告)号：US20210366875A1

公开(公告)日：2021-11-25

申请号：US17137990

申请日：2020-12-30

申请人： WESTERN DIGITAL TECHNOLOGIES, INC.

发明人： Xiaofeng Di ,  Junrong Yan ,  CheeKeong Chin ,  Weili Wang ,  Xin Lu ,  Qi Deng ,  Chaur Yang Ng ,  Cong Zhang ,  Chenlin Yang ,  Chin-Tien Chiu

IPC分类号： H01L25/065 ,  H01L23/00

摘要： A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.

公开(公告)号：US11749647B2

公开(公告)日：2023-09-05

申请号：US17137990

申请日：2020-12-30

申请人： WESTERN DIGITAL TECHNOLOGIES, INC.

发明人： Xiaofeng Di ,  Junrong Yan ,  CheeKeong Chin ,  Weili Wang ,  Xin Lu ,  Qi Deng ,  Chaur Yang Ng ,  Cong Zhang ,  Chenlin Yang ,  Chin-Tien Chiu

IPC分类号： H01L25/065 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L24/48 ,  H01L2224/4845 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2225/06506 ,  H01L2225/06562

摘要： A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.