Polyamide-imide film insulation having improved elongation and fold endurance
    3.
    发明授权
    Polyamide-imide film insulation having improved elongation and fold endurance 失效
    具有改进延伸和折磨耐久性的聚酰亚胺薄膜绝缘

    公开(公告)号:US3867500A

    公开(公告)日:1975-02-18

    申请号:US36765873

    申请日:1973-06-06

    Inventor: TRAYNOR EDWARD J

    CPC classification number: C08L79/08 C08G73/14 C09D179/08

    Abstract: A heavy gauge, high temperature polyimide and polyamide-imide insulating film having a high fold endurance is made by: (1) depositing a solvent solution of a soluble polyamide precursor as a wet film on a substrate directly followed by (2) initially heating the wet film-substrate composite at a temperature of between about 80*C and 110*C, to partially remove solvent and water and form a tack free film-substrate composite directly followed by (3) heating the film-substrate composite to a temperature of at least about 130*C to further dry and semi-cure the film directly followed by (4) stripping the low solvent film from the substrate directly followed by (5) heating the stripped film at a temperature between about 200*C and 350*C and simultaneously stretching the film up to about 150 percent of its original length, to provide a solid, cured, stretched film.

    Abstract translation: 通过以下方法制备具有高折叠耐久性的大规模,高温聚酰亚胺和聚酰胺 - 酰亚胺绝缘膜:(1)将作为湿膜的可溶性聚酰胺前体的溶剂溶液直接沉积在基材上,然后(2)最初加热 湿膜基复合材料,温度在约80℃至110℃之间,以部分去除溶剂和水,并直接形成无粘性膜 - 基质复合材料,然后(3)将膜 - 基底复合材料加热至 至少约130℃,直接进一步干燥和半固化膜,然后直接从基材上剥离低溶剂膜,随后(5)在约200℃至350℃的温度下加热剥离的膜 并且同时将膜拉伸至其原始长度的约150%,以提供固体,固化的拉伸膜。

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