公开(公告)号：US20240237269A1

公开(公告)日：2024-07-11

申请号：US18310572

申请日：2023-05-02

Applicant: WISTRON CORP.

Inventor： HSIEN-YI HUANG ,  Guang Zong Li ,  Chih Lun Chin ,  Che Hao Lee

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/20154 ,  H05K7/2039

Abstract: A cooling assembly is configured for at least one electronic module. The cooling assembly includes at least one thermally conductive plate and at least one cooling pipe. The thermally conductive plate is configured to be attached on one surface of the electronic module. The cooling pipe is configured to be in thermal contact with one side of the thermally conductive plate located farther away from the electronic module. The cooling pipe comprises a pipe wall, and the pipe wall surrounds and forms a fluid channel. The pipe wall of the at least one cooling pipe has a thermally conductive characteristic, and the pipe wall of the at least one cooling pipe is elastically deformable in response to a pressure variation in the fluid channel.