摘要:
A heat dissipation device includes a heat sink including a heat conducting portion and a plurality of fins extending from the heat conducting portion. The heat conducting portion has a base portion for contacting a heat generating device, and two wing portions extending from the base portion. The heat sink has two slits extending through two opposite sides thereof. A fan holder having a fan mounted thereon is attached to a face of the heat sink. The fan holder includes two brackets each having a rib engaged in a corresponding slit of the heat sink to thereby attach the fan holder to the heat sink, and a faceplate having the fan thereon. The faceplate has an ear secured to a corresponding wing portion of the heat sink by a screw and a tab extending upwardly beyond a top end of the heat sink.
摘要:
A back plate assembly for a motherboard includes a back plate, four posts and four plastic rings. The back plate abuts against an underside of the motherboard. The posts extend from the back plate and pass through the motherboard. The rings engage with the posts respectively and elastically abut against an upside of the motherboard.
摘要:
A heat dissipation device includes a heat sink including a heat conducting portion and a plurality of fins extending from the heat conducting portion. The heat conducting portion has a base portion for contacting a heat generating device, and two wing portions extending from the base portion. The heat sink has two slits extending through two opposite sides thereof. A fan holder having a fan mounted thereon is attached to a face of the heat sink. The fan holder includes two brackets each having a rib engaged in a corresponding slit of the heat sink to thereby attach the fan holder to the heat sink, and a faceplate having the fan thereon. The faceplate has an ear secured to a corresponding wing portion of the heat sink by a screw and a tab extending upwardly beyond a top end of the heat sink.
摘要:
A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at two sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The heat sink defines a slot at a side thereof, the guiding member extends at least a fixing arm fixed to the heat sink and a tongue embedded into the slot of the heat sink, thereby attaching the guiding member to the heat sink.
摘要:
A heat dissipation device for an electronic unit includes a heat sink (10), a pair of first heat pipes (20) and a pair of second heat pipes (30). The heat sink includes a base (12) for contacting with the electronic unit (42), a plate (14) spaced from the base, and a plurality of fins (16) arranged between the base and the plate. The first heat pipes are attached to the heat sink and include evaporating portions (22) sandwiched between the base and a bottom portion (162) of the fins for absorbing heat from the base, and condensing portions (24) thermally sandwiched between a top portion (164) of the fins and the plate. The second heat pipes are attached to the heat sink and sandwiched between the base and the bottom portion of the fins.
摘要:
A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at two sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The heat sink defines a slot at a side thereof, the guiding member extends at least a fixing arm fixed to the heat sink and a tongue embedded into the slot of the heat sink, thereby attaching the guiding member to the heat sink.
摘要:
A heat dissipation device for an electronic unit includes a heat sink (10), a pair of first heat pipes (20) and a pair of second heat pipes (30). The heat sink includes a base (12) for contacting with the electronic unit (42), a plate (14) spaced from the base, and a plurality of fins (16) arranged between the base and the plate. The first heat pipes are attached to the heat sink and include evaporating portions (22) sandwiched between the base and a bottom portion (162) of the fins for absorbing heat from the base, and condensing portions (24) thermally sandwiched between a top portion (164) of the fins and the plate. The second heat pipes are attached to the heat sink and sandwiched between the base and the bottom portion of the fins.
摘要:
A fastener, for assembling a fan to a bracket, includes a shaft, and an expanding head extending from an end of the shaft. The shaft has a bulge formed at an opposite end thereof. A handle extends from the bulge of the shaft. The handle is used for facilitating an operator to manipulate the fastener to secure the fan and the bracket together. By pulling the handle of the fastener, the shaft of the fastener extends through the fan and the bracket to reach a position where the head and the bulge of the shaft of the fastener tightly sandwich the fan and the bracket therebetween.
摘要:
A fastener, for assembling a fan to a bracket, includes a shaft, and an expanding head extending from an end of the shaft. The shaft has a bulge formed at an opposite end thereof. A handle extends from the bulge of the shaft. The handle is used for facilitating an operator to manipulate the fastener to secure the fan and the bracket together. By pulling the handle of the fastener, the shaft of the fastener extends through the fan and the bracket to reach a position where the head and the bulge of the shaft of the fastener tightly sandwich the fan and the bracket therebetween.
摘要:
A heat sink assembly includes a heat sink (10), a fan cover (20) mounted on the heat sink and a fan (30) carried by the fan cover. The heat sink comprises a base (12) and a plurality of spaced heat dissipation fins (140) extending from the base. The spaced heat dissipation fins define a plurality of channels (16) extending through front and rear ends of the heat sink. A cavity (40) is formed between the front end of the heat sink and the fan cover. The front end of the heat sink is configured with an arced front edge or an inclined front edge.