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15 条记录 (耗时 0.03 秒)

    Optical interconnect system with layered lightpipe
    1.
    发明授权
    Optical interconnect system with layered lightpipe 有权
    具有分层光管的光互连系统

    公开(公告)号：US06842571B2

    公开(公告)日：2005-01-11

    申请号：US10235735

    申请日：2002-09-05

    申请人： Wayne C. Kramer ,  Daniel R. Schroeder ,  Hans R. Merz ,  Gerald W. Ballard ,  Robert R. Kornowski ,  Jang-Hun Yeh ,  James K. Gehrke

    发明人： Wayne C. Kramer ,  Daniel R. Schroeder ,  Hans R. Merz ,  Gerald W. Ballard ,  Robert R. Kornowski ,  Jang-Hun Yeh ,  James K. Gehrke

    IPC分类号： G02B6/43 ,  G02B6/26 ,  G02B6/42

    CPC分类号： G02B6/43

    摘要： An optical interconnect system includes a stacked arrangement of optical lightpipe layers, one layer assigned to each emitter of the system. The various optical lightpipe layers are designed to provide the same level of light to each receptor of the system. The optical lightpipe layers are very thin, allowing the emitter and receptor devices of the system to span the entire optical lightpipe layer assembly. The path loss between every emitter and every receptor over the entire system can be balanced, i.e., made substantially the same, or otherwise set as desired with respect to individual emitters and receptors.

    摘要翻译： 光学互连系统包括光学管层的堆叠布置，一层分配给系统的每个发射器。 各种光学光管层被设计成为系统的每个受体提供相同水平的光。 光学光管层非常薄，允许系统的发射器和接收器件跨越整个光学光管层组件。 在整个系统中每个发射器和每个受体之间的路径损耗可以平衡，即基本上相同，或根据需要相对于各个发射器和受体而设定。

    Cable and connector system for optical and electrical signals
    2.
    发明授权
    Cable and connector system for optical and electrical signals 失效
    用于光电信号的电缆和连接器系统

    公开(公告)号：US06752657B2

    公开(公告)日：2004-06-22

    申请号：US10266782

    申请日：2002-10-08

    申请人： James K. Gehrke ,  Daniel R. Schroeder ,  Robert R. Kornowski

    发明人： James K. Gehrke ,  Daniel R. Schroeder ,  Robert R. Kornowski

    IPC分类号： G05B644

    CPC分类号： G02B6/4416 ,  G02B6/4293 ,  H01R4/2404

    摘要： A connection system for providing multiple modes of electromagnetic connection to a device. This system includes a ribbon cable with a plurality of multi-mode electromagnetic conductors arranged in a serial array, one alongside the other including a central optical conductor disposed between a pair of electrical conductors. The system also includes a multi-mode electromagnetic connector, that includes a housing, and optical transducers disposed between a pair of electrical terminals that have insulation piercing free ends. A cover that latchingly engages the housing applies pressure to the ribbon cable, forcing the ribbon cable to be pierced by the upper ends of the terminals and pressing the optical conductor into optical communication with said transducers. The electrical conductors carry electrical power comprising alternating current, at a frequency ranging between 10 and 30 kHz.

    摘要翻译： 一种用于向设备提供多种电磁连接模式的连接系统。 该系统包括具有布置成串联阵列的多个多模式电磁导体的带状电缆，一个并排的另外包括设置在一对电导体之间的中心光导体。 该系统还包括多模式电磁连接器，其包括壳体和设置在具有绝缘穿透自由端的一对电端子之间的光学换能器。 与壳体闩锁接合的盖子对带状电缆施加压力，迫使带状电缆被端子的上端刺穿，并且将光导体压迫与所述换能器进行光通信。 电导体承载10至30 kHz频率范围内的交流电。

    Light source housing apparatus and method of manufacture
    9.
    发明授权
    Light source housing apparatus and method of manufacture 失效
    光源住宅设备及其制造方法

    公开(公告)号：US5951152A

    公开(公告)日：1999-09-14

    申请号：US876910

    申请日：1997-06-17

    申请人： Henrick A. Zabawski ,  Robert R. Kornowski ,  Chong S. Kim ,  Chris L. Tsakiridis ,  Daniel R. Schroeder ,  Matthew A. Stahl

    发明人： Henrick A. Zabawski ,  Robert R. Kornowski ,  Chong S. Kim ,  Chris L. Tsakiridis ,  Daniel R. Schroeder ,  Matthew A. Stahl

    IPC分类号： F21V8/00 ,  G02B6/42 ,  H01L33/48 ,  F21V23/00 ,  H01R33/72

    CPC分类号： G02B6/4277 ,  G02B6/0006 ,  H01L33/483 ,  Y10S362/80

    摘要： An apparatus and method of manufacture for a light source housing apparatus. The housing is insert molded around a plurality of electrically separated leads and defines a cavity. A portion of each lead is exposed along a bottom surface of the housing. Two or more leads have terminal portions near a rear surface of the housing. A lead, which can be used to protect against electrostatic discharge, is also mounted along a front face of the housing and terminates at a ring portion which defines an opening that is aligned with the cavity. The opening of the ring portion is preferably sized and shaped to correspond to an outer peripheral surface of a lens, lightpipe or other optical media, so that the lens can be inserted through the ring portion and into the cavity. A light source, such as an LED, is mounted within a cutout of the housing. The housing is manufactured using lead sets each having pre-formed leads indexed by a leadframe through an injection mold to form the housing around each lead set. After the insert molding process at least a portion of the leadframe is removed to electrically isolate the leads. If used with surface mount technology, the housing is preferably self-aligning.

    摘要翻译： 一种用于光源收纳装置的装置和制造方法。 壳体被插入模制在多个电分离的引线周围并且限定空腔。 每个引线的一部分沿壳体的底表面露出。 两个或更多个引线具有靠近壳体后表面的端子部分。 可以用于防止静电放电的引线也沿着壳体的前表面安装并且终止于限定与空腔对准的开口的环部分。 环形部分的开口优选地尺寸和形状以对应于透镜，光管或其它光学介质的外周表面，使得透镜可以插入通过环部分并进入空腔中。 诸如LED的光源安装在壳体的切口内。 外壳使用引线组制造，引线组各自具有通过注射模具由引线框架引导的预成形引线，以在每个引线组周围形成外壳。 在插入成型工艺之后，引线框架的至少一部分被去除以电绝缘引线。 如果与表面贴装技术一起使用，则外壳优选是自对准的。

    Reflow compatible device package
    10.
    发明授权
    Reflow compatible device package 失效
    回流兼容器件封装

    公开(公告)号：US5248848A

    公开(公告)日：1993-09-28

    申请号：US355572

    申请日：1989-05-22

    申请人： Robert R. Kornowski ,  Carl Missele

    发明人： Robert R. Kornowski ,  Carl Missele

    IPC分类号： H01L23/00 ,  H01L23/10 ,  H05K5/00

    CPC分类号： H01L23/564 ,  H01L23/10 ,  H05K5/0095 ,  H01L2924/0002 ,  Y10S220/27

    摘要： An electronic device package includes a portion that functions as a membrane to allow small molecules, such as gas molecules, to relatively freely traverse the housing boundary, while simultaneously substantially preventing large molecules, such as liquid molecules, from entering the confines of the housing. As a result, the package can be readily used in reflow processing without risking damage to the boundary integrity between the housing and the support surface that supports both the electronic device and the housing.

    摘要翻译： 电子器件封装包括用作膜的部分，以允许诸如气体分子的小分子相对自由地穿过壳体边界，同时基本上防止诸如液体分子的大分子进入壳体的界限。 结果，该封装件可以容易地用于回流处理中，而不会损害外壳与支撑电子设备和外壳之间的支撑表面之间的边界完整性。