公开(公告)号：US20150287607A1

公开(公告)日：2015-10-08

申请号：US14418203

申请日：2013-07-31

Applicant: Wayne State University

Inventor： Yong Xu ,  Hongen Tu ,  Eric GR Kim ,  Jessin K. John

IPC: H01L21/3065 ,  H01L21/56

CPC classification number: H01L21/3065 ,  B81C1/0019 ,  G01L19/0092 ,  G01L2009/0069 ,  H01L21/3081 ,  H01L21/56 ,  H01L27/1218 ,  H01L27/1262 ,  H01L29/0657 ,  H01L29/7842 ,  H05K1/0278 ,  H05K1/0283 ,  H05K3/007

Abstract: A method of making a flexible, foldable, stretchable electronic device. The method includes deposition of a polymer layer, such as parylene C, to impart flexibility to the device. The device overcomes the limitations of related flexible electronics schemes by employing established silicon-on-insulator complementary metal-oxide-semiconductor technology with a flexible enclosure. Devices made in such a way may be used in a wide variety of applications including incorporation into medical devices.

Abstract translation: 制造柔性，可折叠，可拉伸的电子装置的方法。 该方法包括聚合物层（例如聚对二甲苯C）的沉积，以赋予该装置的柔性。 该器件通过采用已建立的绝缘体上硅互补金属氧化物半导体技术与柔性封装来克服相关柔性电子方案的局限性。 以这种方式制造的装置可以用于各种应用，包括并入医疗装置。