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    Folded gradient terminal board end connector
    1.
    发明授权
    Folded gradient terminal board end connector 有权
    折叠梯度端子板端连接器

    公开(公告)号：US07548064B1

    公开(公告)日：2009-06-16

    申请号：US12006118

    申请日：2007-12-29

    申请人： Wensen Wang ,  Bruce Courtney Campbell Amm ,  Weijun Yin ,  Yogen Vishwas Utturkar ,  Tunc Icoz

    发明人： Wensen Wang ,  Bruce Courtney Campbell Amm ,  Weijun Yin ,  Yogen Vishwas Utturkar ,  Tunc Icoz

    IPC分类号： G01V3/00

    CPC分类号： G01R33/3858 ,  G01R33/4215

    摘要： A folded gradient terminal board end connector includes a multi-layer terminal connection board having a plurality of connection paths and vias configured to provide intercrossing between a plurality of folded gradient coils and further to provide symmetry between the plurality of folded gradient coils without spatial interference between folded portions of the plurality of folded gradient coils to optimize the folded gradient coil efficiency.

    摘要翻译： 折叠梯度端子板端连接器包括多层端子连接板，多层端子连接板具有多个连接路径和通孔，其构造成提供多个折叠梯度线圈之间的交叉，并进一步提供多个折叠梯度线圈之间的对称，而没有空间干涉 多个折叠梯度线圈的折叠部分以优化折叠的梯度线圈效率。

    FOLDED GRADIENT TERMINAL BOARD END CONNECTOR
    2.
    发明申请
    FOLDED GRADIENT TERMINAL BOARD END CONNECTOR 有权
    折叠式梯形端子连接器

    公开(公告)号：US20090167306A1

    公开(公告)日：2009-07-02

    申请号：US12006118

    申请日：2007-12-29

    申请人： Wensen Wang ,  Bruce Courtney Campbell Amm ,  Weijun Yin ,  Yogen Vishwas Utturkar ,  Tunc Icoz

    发明人： Wensen Wang ,  Bruce Courtney Campbell Amm ,  Weijun Yin ,  Yogen Vishwas Utturkar ,  Tunc Icoz

    IPC分类号： G01R33/28

    CPC分类号： G01R33/3858 ,  G01R33/4215

    摘要： A folded gradient terminal board end connector includes a multi-layer terminal connection board having a plurality of connection paths and vias configured to provide intercrossing between a plurality of folded gradient coils and further to provide symmetry between the plurality of folded gradient coils without spatial interference between folded portions of the plurality of folded gradient coils to optimize the folded gradient coil efficiency.

    摘要翻译： 折叠梯度端子板端连接器包括多层端子连接板，多层端子连接板具有多个连接路径和通孔，其构造成提供多个折叠梯度线圈之间的交叉，并进一步提供多个折叠梯度线圈之间的对称，而没有空间干涉 多个折叠梯度线圈的折叠部分以优化折叠的梯度线圈效率。

    Thermal management system for cooling a heat generating component of a magnetic resonance imaging apparatus
    5.
    发明授权
    Thermal management system for cooling a heat generating component of a magnetic resonance imaging apparatus 有权
    用于冷却磁共振成像装置的发热部件的热管理系统

    公开(公告)号：US07812604B2

    公开(公告)日：2010-10-12

    申请号：US11939611

    申请日：2007-11-14

    申请人： Tunc Icoz ,  Mehmet Arik ,  Yogen Vishwas Utturkar ,  Bruce Courtney Campbell Amm

    发明人： Tunc Icoz ,  Mehmet Arik ,  Yogen Vishwas Utturkar ,  Bruce Courtney Campbell Amm

    IPC分类号： G01V3/00 ,  A61B5/05

    CPC分类号： G01R33/34 ,  G01R33/3403 ,  G01R33/3856

    摘要： A thermal management system for cooling a heat generating component of a Magnetic Resonance Imaging (MRI) apparatus includes at least one heat pipe having a portion disposed proximate the heat generating component, such as a gradient coil and/or RF coil. When heat is removed from the component, a working fluid in a relatively hotter end of the heat pipe vaporizes and travels toward a relatively colder end of the heat pipe. The colder end may be operatively coupled to a heat sink for removing the heat from the colder end and increase the overall efficiency of the system. The heat pipe may be disposed along a horizontal, a vertical direction and/or along a diagonal of the heat generating component.

    摘要翻译： 用于冷却磁共振成像（MRI）装置的发热部件的热管理系统包括至少一个热管，其具有靠近发热部件设置的部分，例如梯度线圈和/或RF线圈。 当从组件中除去热量时，热管的相对较热端的工作流体向热管的相对较冷的端部蒸发并行进。 较冷的端部可以可操作地联接到散热器，以从较冷的端部移除热量并且增加系统的整体效率。 热管可以沿着水平，垂直方向和/或沿着发热部件的对角线布置。

    THERMAL MANAGEMENT SYSTEM FOR COOLING A HEAT GENERATING COMPONENT OF A MAGNETIC RESONANCE IMAGING APPARATUS
    6.
    发明申请
    THERMAL MANAGEMENT SYSTEM FOR COOLING A HEAT GENERATING COMPONENT OF A MAGNETIC RESONANCE IMAGING APPARATUS 有权
    用于冷却磁共振成像装置的发热元件的热​​管理系统

    公开(公告)号：US20090120615A1

    公开(公告)日：2009-05-14

    申请号：US11939611

    申请日：2007-11-14

    申请人： Tunc Icoz ,  Mehmet Arik ,  Yogen Vishwas Utturkar ,  Bruce Courtney Campbell Amm

    发明人： Tunc Icoz ,  Mehmet Arik ,  Yogen Vishwas Utturkar ,  Bruce Courtney Campbell Amm

    IPC分类号： F28D15/00

    CPC分类号： G01R33/34 ,  G01R33/3403 ,  G01R33/3856

    摘要： A thermal management system for cooling a heat generating component of a Magnetic Resonance Imaging (MRI) apparatus includes at least one heat pipe having a portion disposed proximate the heat generating component, such as a gradient coil and/or RF coil. When heat is removed from the component, a working fluid in a relatively hotter end of the heat pipe vaporizes and travels toward a relatively colder end of the heat pipe. The colder end may be operatively coupled to a heat sink for removing the heat from the colder end and increase the overall efficiency of the system. The heat pipe may be disposed along a horizontal, a vertical direction and/or along a diagonal of the heat generating component.

    摘要翻译： 用于冷却磁共振成像（MRI）装置的发热部件的热管理系统包括至少一个热管，其具有靠近发热部件设置的部分，例如梯度线圈和/或RF线圈。 当从组件中除去热量时，热管的相对较热端的工作流体向热管的相对较冷的端部蒸发并行进。 较冷的端部可以可操作地联接到散热器，以从较冷的端部移除热量并且增加系统的整体效率。 热管可以沿着水平，垂直方向和/或沿着发热部件的对角线布置。

    Heat sinks with distributed and integrated jet cooling
    8.
    发明授权
    Heat sinks with distributed and integrated jet cooling 有权
    散热器采用分布式和集成式喷射冷却

    公开(公告)号：US08496049B2

    公开(公告)日：2013-07-30

    申请号：US12421068

    申请日：2009-04-09

    申请人： Mehmet Arik ,  Tunc Icoz ,  Juan Manuel Rivas Davila ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar ,  Stanton Earl Weaver, Jr.

    发明人： Mehmet Arik ,  Tunc Icoz ,  Juan Manuel Rivas Davila ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar ,  Stanton Earl Weaver, Jr.

    IPC分类号： H05K7/20

    CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

    摘要翻译： 提供分布式喷射冷却的散热器。 散热器包括用于热连接到至少一个被加热物体的基座，热耦合到基座的翅片阵列，以及设置在翅片阵列侧面的至少一个多孔合成射流或多个单孔射流。 还提供了具有分布式和集成式射流冷却的散热器，并且包括底座和翅片阵列。 翅片的至少一个子集中的各个翼片包括配置成将周围流体喷射到翅片和底座的周围环境中的合成射流。 提供了具有分布式和集成的喷射式冷却的另一散热器，并且包括底座，翅片阵列和耦合到相应散热片的多个合成射流。 合成射流被提供用于鳍的至少一个子集。

    HEAT SINKS WITH DISTRIBUTED AND INTEGRATED JET COOLING
    10.
    发明申请
    HEAT SINKS WITH DISTRIBUTED AND INTEGRATED JET COOLING 有权
    散热和集成喷射冷却的散热器

    公开(公告)号：US20100258270A1

    公开(公告)日：2010-10-14

    申请号：US12421068

    申请日：2009-04-09

    申请人： Mehmet Arik ,  Tunc Icoz ,  Juan Manuel Rivas Davila ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar ,  Stanton Earl Weaver, JR.

    发明人： Mehmet Arik ,  Tunc Icoz ,  Juan Manuel Rivas Davila ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar ,  Stanton Earl Weaver, JR.

    IPC分类号： F28F13/00

    CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

    摘要翻译： 提供分布式喷射冷却的散热器。 散热器包括用于热连接到至少一个被加热物体的基座，热耦合到基座的翅片阵列，以及设置在翅片阵列侧面的至少一个多孔合成射流或多个单孔射流。 还提供了具有分布式和集成式射流冷却的散热器，并且包括底座和翅片阵列。 翅片的至少一个子集中的各个翼片包括配置成将周围流体喷射到翅片和底座的周围环境中的合成射流。 提供了具有分布式和集成的喷射式冷却的另一散热器，并且包括底座，翅片阵列和耦合到相应散热片的多个合成射流。 合成射流被提供用于鳍的至少一个子集。