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    SYSTEM INCLUDING THERMAL INTERFACE MATERIAL
    2.
    发明申请
    SYSTEM INCLUDING THERMAL INTERFACE MATERIAL 审中-公开
    包括热界面材料的系统

    公开(公告)号：US20130224510A1

    公开(公告)日：2013-08-29

    申请号：US13408305

    申请日：2012-02-29

    申请人： Tao Deng ,  Yogen Vishwas Utturkar ,  Binoy Milan Shah ,  Charles Franklin Wolfe, JR. ,  Pramod Chamarthy

    发明人： Tao Deng ,  Yogen Vishwas Utturkar ,  Binoy Milan Shah ,  Charles Franklin Wolfe, JR. ,  Pramod Chamarthy

    IPC分类号： B32B15/01 ,  B29C65/48

    CPC分类号： H01L23/42 ,  H01L23/4275 ,  H01L2924/0002 ,  Y10T428/12222 ,  H01L2924/00

    摘要： A system for heat transfer along with the method of preparation of the same is described. System includes a first surface, a second surface, and an interface material. The interface material is disposed between the first and second surfaces such that it is solid at an assembling temperature and liquid at an operating temperature. The first surface of the system is configured to adhere to the solid and liquid thermal interface material, and the second surface is configured to adhere to the liquid thermal interface material and be detachable from the solid interface material. The method of preparation of the system includes disposing the first surface, an interface material, and a second surface, heating the interface material to above its melting point and then cooling to a temperature below melting point to detach and remove the second surface from the interface material.

    摘要翻译： 描述了一种用于传热的系统及其制备方法。 系统包括第一表面，第二表面和界面材料。 界面材料设置在第一和第二表面之间，使得其在组装温度下为固体，并且在工作温度下为液体。 系统的第一表面被配置为粘附到固体和液体热界面材料，并且第二表面被配置为粘附到液体热界面材料并且可从固体界面材料上分离。 制备该系统的方法包括设置第一表面，界面材料和第二表面，将界面材料加热到其熔点之上，然后冷却到低于熔点的温度以从界面分离和去除第二表面 材料。

    METHOD AND APPARATUS FOR IMPROVED COOLING OF A HEAT SINK USING A SYNTHETIC JET
    3.
    发明申请
    METHOD AND APPARATUS FOR IMPROVED COOLING OF A HEAT SINK USING A SYNTHETIC JET 审中-公开
    使用合成喷嘴改善散热的方法和装置

    公开(公告)号：US20110174462A1

    公开(公告)日：2011-07-21

    申请号：US13074700

    申请日：2011-03-29

    申请人： Mehmet Arik ,  Yogen Vishwas Utturkar

    发明人： Mehmet Arik ,  Yogen Vishwas Utturkar

    IPC分类号： F28F13/00 ,  B21D53/02

    CPC分类号： F28F3/022 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A system for cooling a device includes a heat sink comprising a substrate having a plurality of fins arranged thereon, a fan positioned to direct an ambient fluid in a first direction across the heat sink, and a first synthetic jet assembly comprising one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets. The first synthetic jet assembly is configured to direct the ambient fluid in a second direction across the heat sink, wherein the second direction is approximately perpendicular to the first direction.

    摘要翻译： 一种用于冷却装置的系统包括：散热器，其包括其上布置有多个翅片的基板，定位成沿着第一方向引导环境流体穿过散热器的风扇;以及第一合成射流组件， 孔口合成射流和多个单孔合成射流。 第一合成喷射器组件被构造成引导围绕散热器的第二方向的环境流体，其中第二方向大致垂直于第一方向。

    SYSTEM AND METHOD FOR THERMO-ELECTRIC COOLING OF RF COILS IN AN MR IMAGING SYSTEM
    4.
    发明申请
    SYSTEM AND METHOD FOR THERMO-ELECTRIC COOLING OF RF COILS IN AN MR IMAGING SYSTEM 有权
    用于MR成像系统中RF线圈的热电冷却的系统和方法

    公开(公告)号：US20110025329A1

    公开(公告)日：2011-02-03

    申请号：US12533342

    申请日：2009-07-31

    申请人： Yogen Vishwas Utturkar ,  Jennifer L. Jackson ,  Charles Franklin Wolfe ,  Bruce C. Amm

    发明人： Yogen Vishwas Utturkar ,  Jennifer L. Jackson ,  Charles Franklin Wolfe ,  Bruce C. Amm

    IPC分类号： G01R33/28 ,  H05K7/20

    CPC分类号： G01R33/3403 ,  G01R33/34007 ,  G01R33/34076 ,  Y10T29/49826

    摘要： A cooling system for reducing the thermal energy transfer from the heated spots of an RF coil assembly to a patient bore of an MRI system is disclosed. The MRI system includes a plurality of gradient coils positioned about a bore of a magnet, an RF shield formed about an RF space, and an RF coil assembly positioned within the RF space and about the patient bore. The cooling system is positioned within the RF space and includes a plurality of cooling modules configured to reduce an operating temperature of the MRI system. Each of the plurality of cooling modules further includes a thermoelectric cooler thermally coupled to the RF coil and a heat sink thermally coupled to the thermoelectric cooler opposite from the RF coil. The thermoelectric cooler is configured to extract heat from the RF coil when a current is applied to the thermoelectric cooler.

    摘要翻译： 公开了一种用于减少从RF线圈组件的加热点到MRI系统的患者孔的热能传递的冷却系统。 MRI系统包括围绕磁体的孔定位的多个梯度线圈，围绕RF空间形成的RF屏蔽和位于RF空间内以及围绕患者孔的RF线圈组件。 冷却系统位于RF空间内，并且包括被配置为降低MRI系统的操作温度的多个冷却模块。 多个冷却模块中的每一个还包括热耦合到RF线圈的热电冷却器和与RF线圈相对的热耦合热电冷却器的散热器。 热电冷却器被配置为当电流被施加到热电冷却器时从RF线圈提取热量。

    Thermal management system for cooling a heat generating component of a magnetic resonance imaging apparatus
    5.
    发明授权
    Thermal management system for cooling a heat generating component of a magnetic resonance imaging apparatus 有权
    用于冷却磁共振成像装置的发热部件的热管理系统

    公开(公告)号：US07812604B2

    公开(公告)日：2010-10-12

    申请号：US11939611

    申请日：2007-11-14

    申请人： Tunc Icoz ,  Mehmet Arik ,  Yogen Vishwas Utturkar ,  Bruce Courtney Campbell Amm

    发明人： Tunc Icoz ,  Mehmet Arik ,  Yogen Vishwas Utturkar ,  Bruce Courtney Campbell Amm

    IPC分类号： G01V3/00 ,  A61B5/05

    CPC分类号： G01R33/34 ,  G01R33/3403 ,  G01R33/3856

    摘要： A thermal management system for cooling a heat generating component of a Magnetic Resonance Imaging (MRI) apparatus includes at least one heat pipe having a portion disposed proximate the heat generating component, such as a gradient coil and/or RF coil. When heat is removed from the component, a working fluid in a relatively hotter end of the heat pipe vaporizes and travels toward a relatively colder end of the heat pipe. The colder end may be operatively coupled to a heat sink for removing the heat from the colder end and increase the overall efficiency of the system. The heat pipe may be disposed along a horizontal, a vertical direction and/or along a diagonal of the heat generating component.

    摘要翻译： 用于冷却磁共振成像（MRI）装置的发热部件的热管理系统包括至少一个热管，其具有靠近发热部件设置的部分，例如梯度线圈和/或RF线圈。 当从组件中除去热量时，热管的相对较热端的工作流体向热管的相对较冷的端部蒸发并行进。 较冷的端部可以可操作地联接到散热器，以从较冷的端部移除热量并且增加系统的整体效率。 热管可以沿着水平，垂直方向和/或沿着发热部件的对角线布置。