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    Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member
    2.
    发明申请
    Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member 审中-公开
    使用由保留构件在插入件的孔径中捕获的弹性线束电连接两个基板的方法和装置

    公开(公告)号：US20070226997A1

    公开(公告)日：2007-10-04

    申请号：US11760925

    申请日：2007-06-11

    申请人： William Brodsky ,  John Colbert ,  Roger Hamilton ,  Amanda Mikhail ,  Mark Plucinski

    发明人： William Brodsky ,  John Colbert ,  Roger Hamilton ,  Amanda Mikhail ,  Mark Plucinski

    IPC分类号： H01R43/00 ,  H05K3/36

    CPC分类号： H01R13/2407 ,  H01R12/52 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208

    摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

    摘要翻译： 一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。 插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。 弹性线束设置在每个孔中。 非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。 每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。 一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。 在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。